CONTENT 04 BISINFOTECH.COM
ROHM Revs-Up Formula E racing Team Venturi TESTING EDA IN 2018
DESIGN, DEVELOPMENT, AND EVALUATION OF A SYSTEM TO OBTAIN ELECTRODERMAL ACTIVITY
299 PHL-4TSI: THE IDEAL DCLINK CAPACITOR FOR FIXED EV CHARGERS
HEILIND ELECTRONICS SENIOR REGIONAL SALES MANAGER â€“ SOUTH ASIA PACIFIC, HK/JP/KR
SANJAY GUPTA VICE PRESIDENT & INDIA COUNTRY MANAGER | NXP
SMART POWER PLUG
Smart Grids Overcome Renewable Energy Variability & Uncertainty
PRESIDENT AND CHIEF OPERATING OFFICER | MICROCHIP TECHNOLOGY INC. BISINFOTECH.COM 05
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LETTER FROM THE EDITOR Bis Infotech support and accordance has been impressive. Propelling further and understanding the value of the Industrial Tech Industry, Bis Infotech unveils its Print Version. Extending and committed to focus on the industry ahead: Bis Infotech Will Extensively Telescope on 1. Complete ESDM Ecosystem 2. Industrial Electronics 3. Hyper-convergence of IT & OT 4. Design Theory of Next – Gen Electronics. 5. Mentoring the Engineer and Decision Maker Fraternity through Interview, Guest Articles and Op-eds. 6. A Month Look into Every Current happening across the Semiconductor, IT&OT and its associated Updates. 7. Inviting never-seen Design Ideas for Budding and Experts of the Semiconductor industry. 8. Media Associates to the Biggest Events Globally and positioning the Semiconductor and Industrial Tech Industry respectively. 9. Bringing Exclusively Editor-Desk, wherein the Semiconductor companies and industrial Tech Industries Leaders will be featured. 10. Bringing together the wave of Industry 4.0 and Digital transformation under one roof. Join the biggest meet of the industry leaders, influencers, engineers, developers and decision-makers in print flavour wherein Bis will churn out the prophecy of “Complete Industrial Tech Industry.”
Avnet Asia and Vietnam Top University Inks MOU to Upskill Young-Minds on IoT Trends and Applications Avnet Asia has inked a Memorandum of Understanding (MOU) with the Hanoi University of Science and Technology (HUST). Under the MoU, Avnet and HUST will upskill students of second and third year from the School of Electrical Engineering at the university on key IoT trends and innovations, and skills in deploying IoT applications with a team of Avnet technical experts. Citing on the MoU, Frederick Fu, President of Avnet Asia Pacific said, "Vietnam is an important market for Avnet. It is one of the fastest-growing economies in the world and it has massive potential to harness the power of IoT. Avnet has been actively nurturing the next-generation of local engineers through various platforms to support Vietnam in becoming a leading technology hub." "We are very excited to partner HUST, one of the top engineering schools in Vietnam. Avnet strives to work closely with engineering students, who will be the ones shaping the future of Vietnam by driving economic growth and technological innovation. We recognize that students here are eager to learn more about both the new technologies, and their industry applications -- and Avnet can play a key role in enriching their knowledge across both with our strong technical and design teams, and connected ecosystem. Through this education program, we want to help add market value in Vietnam by empowering a group of young talents to design their own applications, to spur innovation and entrepreneurship." A Gist of the Program • The program developed by Avnet will consist of workshops and seminars that complement Vietnam's thriving technology scene. • These masterclasses will be focused on the building blocks of IoT which encompass microprocessor usage, power design, motor control and measurement. • Students will also be introduced to a comprehensive range of demonstration kits from Avnet and its suppliers, and apply the tools provided to create various applications for the automotive, industrial, communication and other industries.
Arrow Electronics’ Extensive IoT Solutions to Stage at Microsoft IoT in Action Event in Seoul Arrow Electronics announces its participation in the Microsoft IoT in Action event held in Seoul on January 30. As a Microsoft IoT aggregator partner and platinum sponsor of the event, Arrow will exhibit several Internet of Things (IoT) solutions that integrate sensors, software and cloud connections, and help event attendees understand how they can meet customer needs and grow their businesses by building repeatable IoT solutions. Some of the IoT technologies and solutions Arrow will display at the event include: • A low-power, robust and ready-to-deploy Waspmote plug and sensor system from Libelium that can monitor water, air and weather conditions and trigger alerts for preventive measures. • A local proof-of-concept urban-agricultural IoT solution with sensor module, mesh protocol connectivity and gateway solution designed for managing greenhouse environment and generating data analytics for optimal operation. • Arrow Connect running on Microsoft Azure, a cloud-based platform designed and developed by Arrow, enables the seamless and secure flow of data on any device or edge over any protocol to any cloud, as well as securely provision and manage all IoT devices. Citing on the Arrow Electronics’ participation, Aiden Mitchell, vice president of IoT global solutions at Arrow, said, Developing the kind of smart and connected devices needed to deliver the expected IoT outcomes and benefits draws on a broad spectrum of technologies and expertise.
Mouser Electronics has signed a global distribution agreement with Espressif Systems. Under the agreement, Mouser is now an authorized distributor of Espressif's popular and affordable line of ESP8266 and ESP32-based low-power wireless systems-on-chip (SoCs), modules, and development boards for Internet of Things (IoT) applications. Now Exclusive at Mouser Electronics, the Espressif portfolio of solutions Offers: • It consists of a comprehensive assortment of innovative, versatile solutions that enable low-cost wireless connectivity for a broad range of wireless applications. Espressif’s ESP8266EX, ESP8285, and ESP8089 Wi-Fi SoCs are highly integrated Wi-Fi solutions based on a low-power 32-bit Tensilica microcontroller. • The SoCs incorporate antenna switches, a power amplifier, and other components onto a compact 5x5 mm QFN package. • The single-chip solutions feature system-level power management and offer SPI, SDIO 2.0, and UART interfaces, with the ESP8266EX and ESP8089 SoCs also offering I2C, I2S, PWM, and GPIO. • ESP32 SoCs are a single 2.4 GHz Wi-Fi and Bluetooth combo chips designed for mobile and wearable devices and the IoT. • The chips feature a dual-core system architecture with two Xtensa LX6 CPUs, and integrate radio and antenna switching circuitry with ultra-low power consumption. • The ESP32-DOWDQ6 and ESP32-DOWD SoCs feature 520 Kbytes of SRAM, 448 Kbytes of ROM, and 16 Kbytes of SRAM in RTC. • The ESP32-D2WD includes the same features of the ESP32-D0W, but adds 2 Mbytes of embedded on-chip flash memory. • Espressif single-core Wi-Fi modules are fully pre-certified, allowing faster time to market with reduced development costs. Both the ESP-WROOM-02 and ESP-WROOM-S2 feature an embedded ESP8266EX chip and 2 Mbytes of flash memory. The ESP-WROOM-S2 can work as the SDIO/SPI slave, with SPI speed up to 8 Mbps. Espressif dual-core Wi-Fi and Bluetooth low energy modules are high-performance, low-power devices designed to provide a complete wireless solution tailored to advanced IoT applications. Both the ESP-WROOM-32 and ESP32-WROVER modules are based on the ESP32-D0WDQ6 SoC and include 4 Mbytes of flash memory. The ESP32-WROVER (with PCB antenna) and ESP32-WROVER-I (with IPEX antenna) add 4 Mbytes of external pseudo-static random-access memory (PSRAM) that supports audio products and other applications. Mouser also offers a selection of Espressif’s versatile development boards. The ESP-WROVER-KIT is Espressif’s most versatile development board. The board, compatible with ESP32 modules, offers a rich list of features, such as onboard high-speed microSD card interface, VGA camera interface, as well as a 3.2-inch SPI LCD panel and I/O expansion capabilities. The ESP32-DevKitC includes a mounted ESP-WROOM-32 module that combines Wi-Fi, Bluetooth Classic, and Bluetooth low energy, and offers a pinout optimized for including the board on a breadboard for easy prototyping. The ESP-Launcher is a Micro USB-powered development board that allows access to all 32 pins of ESP8266 SoC. The board helps engineers develop solutions based on the ESP-WROOM-32 module as well as the ESP32 SoC.
Mouser Signs Latest Deal With Espressif Systems, to Distribute Wireless SoCs and Modules for IoT
Infineon Defies Sluggish US$ With Strong Momentum in Q1 of FY 2018
Infineon Technologies has reported its results for the first quarter of the 2018 fiscal year (period ended 31 December 2017). The German Semiconductor Giant in this quarter logged revenue of €1,775 million. Infineon in its official release stated only due to the weaker US$ based on an assumed exchange rate of US$ 1.25 to the euro for the remainder of the fiscal year, year-on-year revenue growth of about 5 percent (plus or minus 2 percentage points) and Segment Result Margin of 16,5 percent at mid-point of revenue guidance. Infineon has made a strong start to the new fiscal year, stated Dr. Reinhard Ploss, CEO of Infineon. Earnings and margin were better than forecast – despite the expected slight seasonal dip in revenues. The market for electro-mobility continues to drive growth. Infineon offers solutions for the entire range of drivetrain systems from hybrid to pure electric vehicles. Moreover, we continue to benefit from excellent market conditions, which are driving high demand for power components used in applications across the board, such as solar power plants, especially in China, and also for data centers.
ETRI Develops Aldebaran5 - A Next-Gen Autonomous Vehicle Computing Platform in a Single Chip The Processor Research Group at ETRI announces development of a processor for self-driving cars dubbed as Aldebaran5. Aldebaran5 is touted to feature 9 cores to provide high computing power as well as safety mechanisms to ensure reliability for automotive applications, while exhibiting industry leading power efficiency (~1 watt) and a tiny form factor (smaller than the size of a nail head.) Codenamed Aldebaran5 after the brightest star in the constellation of Taurus, the chip is a significantly upgraded version of its predecessor. Nine cores provide ample computing power, 4 of which are dynamically programmable to operate for performance or for reliability. Safety features adhering to international standards ensure reliability with 99% detection coverage of faults and malfunctions and includes recovery mechanisms to mitigate potential negative effects. Dedicated custom-designed acceleration circuitry for image recognition and HEVC (high efficiency video coding) as well as CAN bus communication hardware and an image signal processor (ISP) are integrated into the SoC, all combining to provide a robust and streamlined computing platform designed for autonomous vehicle applications. Research and development to integrate neural network acceleration hardware in order to provide artificial intelligence capabilities are near completion and expected to be announced within the year. Key Applications Include A wide range of applications have been demonstrated on Aldebaran5 attesting to a powerful, efficient, robust, yet reliable computing platform tailor-made for autonomous vehicle applications. These include real time pedestrian and vehicle recognition, lane detection/ warning/keeping system, ultra high definition black box functionality (dash cam), interfacing and processing of various sensor data (radar, GPS, etc) and vehicle maneuvering via CAN bus control, among others.
Atos Awarded Global Leader in IoT Services by Everest Group Atos has been named a global Leader by Everest Group. Everest Group in its latest report: IoT Services PEAK Matrix Assessment and Market Trends 2017. Atos’ System Integration and Operations capabilities and Worldline’s ready-to-use solutions and are recognized for enabling clients to progress rapidly from PoC to production. In the report, leaders are ‘delivering strategic value to their customers’ which ‘forms the core of their value proposition and a futuristic approach for IoT services development roadmap is witnessed’ and have ‘led their customers through large scale transformation journeys powered by IoT’. “We witness a 25% increase in IoT pilot projects moving to production stage, and Atos’ consulting driven engagement model has further supported its customers to progress from POC to production stage rapidly and to achieve concrete business results. Additionally, Atos’ investments in R&D and strategic partnerships across the IoT stack together with Worldline’s ready to use solutions has enabled it to deliver innovative and secure IoT solutions across different industries,” said Yugal Joshi, Practice Director, Everest Group. Elaborating on Atos’ role as a leader in IoT, Dominique Grelet, Global Head of Atos Codex IoT Services at Atos said: “We are proud to be recognized as a global Leader in IoT Services by Everest Group. This validates our ability to effectively leverage agile processes, innovative tooling and automation, while working with our extensive IoT partner ecosystem, to deliver, manage and secure the full IoT value chain from connected devices to edge computing to the datacenter.” These IoT services combine Atos’ horizontal connectivity and platform services, such as the platforms delivered by Worldline, European leader in the payments and transactional services industry and an Atos company, and partner platforms such as Amazon Web Services and Microsoft Azure, with advanced, (vertical) business-driven analytics, apps and use cases, enable customers to securely transform data into reliable business value in every market. The deep integration with company processes - such as ERP (Enterprise Resource Planning) and PLM (Product Lifecycle Management) - is a key differentiator as it gives Atos the ability to take end-to-end responsibility.
Fujitsu announces new Fujitsu Reference
Architecture for Commvault HyperScale Software. The new rollout is sought to upfront the benefits of the cloud - in terms of service, agility, resilience, scale and cost - to on-premises backup storage. This new reference architecture is known to be the third data protection solution developed by
Fujitsu Announces On-Premises Backup Infrastructures Delivers Cloud-like Scalability and Agility
Fujitsu with Commvault. Fujtsu confirms that the new enhanced software is a data protection solution based on pre-tested configurations and built with Commvault HyperScale Software and Fujitsu Server PRIMERGY industry-standard server systems. Key Nuggets Include • It simplifies the transformation into private cloud storage, with complete data portability for seamless integration between the public cloud and on-premises environments. • It brings cloud agility, economics and service levels to on-premises data protection and recovery, enabling organizations to build a unified, modern data protection and management platform on a scale-out infrastructure. Citing on the new rollout, Olivier Delachapelle, Head of Category Management Data Center at Fujitsu in EMEIA, said, “Protecting data against loss has become number one priority in a digital world. However, traditional heterogeneous point solutions for backup and archiving may have slowed down business process transformation due to limited flexibility and hardware choice. We are changing that with our new Fujitsu Reference Architecture for Commvault HyperScale Software. This replaces legacy data protection architectures with a software-defined solution, based on economical, general purpose, server-based
storage. The new architecture boosts agility by consolidating and eliminating data silos, and shrinking the footprint of on-premises hardware – as well as providing that allimportant holistic, big-picture view of their data, wherever it’s stored.” The Fujitsu Reference Architecture for Commvault HyperScale Software is designed for organizations that require greater capacity or performance needs than available from an appliance-based approach. Fujitsu uses pre-validated configurations that provide hardware sizes and models for Commvault Hyperscale Software on a unique scale-out infrastructure. This simplified approach reduces both the integration time and risk associated with multiple point solutions, while injecting scalability with predictable economics and performance. Customers gain a fully-tested, easy-to-set-up data protection solution for backing up and archiving data in physical, virtual or cloudbased data centers. “We welcome Fujitsu to the reference architecture program for Commvault
Commvault. “Today’s enterprise customers want the agility and economics of the cloud on-premises, so scale out data protection software with Commvault HyperScale is highly attractive. Fujitsu’s experience in the enterprise, and the pairing of it’s world class hardware portfolio with Commvault data protection, provide customers with pre-validated solutions to help them gain a fresh approach to data protection and on-premises infrastructures.” The new reference architecture complements Fujitsu’s wider portfolio of data protection appliance solutions, such as the ETERNUS CS200c and the Commvault HyperScale Appliance. Pricing and availability The new Fujitsu Reference Architecture for Commvault HyperScale Software will be available to order in the EMEIA region as of March 2018, and can be purchased directly from Fujitsu and via distribution partners. Pricing depends on system configuration and may vary by country.
HyperScale Software,” said Jonathan Howard, Director, Technical Alliances,
Rinspeed "Snap" Car Banks on HARTING’s Fast Charging Technology, Showcases at CES 2018 Las Vegas Swiss automobile manufacturer Rinspeed at CES 2018, Las Vegas presented its new concept vehicle "Snap". The Snap car from Rinspeed is using innovative HARTING technology to provide rapidcharge technology to quickly charge the "Snap" with electricity in an environmentally-friendly manner. "Besides conventional charging technology, almost all new e-car concepts from the big OEMs rely on high-performance fast charging. This will boost driver acceptance. This is the breakthrough," says HARTING Automotive Managing Director Marco Grinblats with confidence. Grinblats sees the potential of an end-to-end network of conventional and fast charging stations which extends beyond just Germany. At the end of 2016, HARTING became a direct supplier to the VW Group for a specific e-mobility solution. HARTING supplies various types of charging equipment for different Group brands, among others for the Porsche Panamera 4-Hybrid. HARTING is also a Tier 1 supplier for BMW Group. HARTING Technology Group has long track of innovating the automotive supplier industry market. Fast Charging technology – premiered at the Geneva Motor Show 2016 – is a convincing example of its growing portfolio of products and components. The new project is known to be already the third successful collaboration between the Rinspeed think tank and HARTING. Last year, HARTING's miniMICA acted as a scalable and flexible architecture in the "Oasis" concept vehicle. In 2016, the HARTING MICA was installed in Rinspeed's "Etos" vehicle for independent emission and condition monitoring and garnered the "HERMES AWARD" that year. The "Snap" will be on display for all to marvel at on the Rinspeed stand at the Geneva Motor Show (March 8-18, 2018) and at the HARTING stand at the HANNOVER MESSE (April 23-27, 2018).
Digi-Key Now Ships Sigfox SDR Dongle Developers’ Platform Digi-Key Electronics announces shipping of the new Sigfox SDR dongle. Now exclusive at Digi-Key Electronics, the Sigfox SDR dongle, designed for device and solution makers to speed up development and tests. The SDR dongle allows for development of Sigfox devices independent from Sigfox public network coverage. The Sigfox SDR dongle is the hardware platform on which to run the Sigfox Device Test Suite, a comprehensive device developer software toolkit: The Network Emulator: Developed to test end-to-end and bidirectional data transport services between your device and your application The Radio Signal Analyzer: Developed to test radio compliance with Sigfox Verified certification requirements SDR dongle will accelerate adoption of Sigfox technology for partners all across the world, says Laetitia Jay, Chief Marketing Officer at Sigfox. We feel excited that Digi-Key now provides essential developer tools for quick starting, prototyping and fast developing scalable IoT solutions. The Sigfox SDR dongle is a powerful and configurable radio Receiver and Transmitter emulating the Sigfox network. It is the easiest way for device and solution makers to speed up development and tests, without the need for network coverage and for every country’s radiofrequency configuration. “We’re excited to advance our role as an ecosystem partner of Sigfox and continue to increase our portfolio to support customers in their Sigfox journey,” said Robbie Paul, Director, IoT Business Development at Digi-Key. “With our global reach, the Sigfox SDR dongle will be available to everyone and will allow any device maker to start designing devices regardless of the radio zone they are in or where an R&D team is located.”
299 PHL-4TSI: The Ideal DCLink Capacitor for Fixed EV Chargers To do their job properly, electric vehicle (EV) chargers need to handle a lot of power. Depending on battery capacity, an overnight recharge can require up to 30 kW. A fast charge at a high-voltage charging station, which replenishes the battery to 80 % of its capacity, can use as much as 250 kW. A long-life DC-link capacitor bank plays a key role in the EV charger’s high voltage power circuits to enable charging in the shortest possible time while minimizing battery aging and maintaining safe operation. It provides a stable DC voltage for the switch mode power circuit that controls the rate of charge. At the same time, it functions as the low-impedance return path for the switching currents from that same circuit. If the DC-link capacitor bank stops working, the battery charger will stop working as well. Vishay’s 299 PHL-4TSI 400 V and 450 V snap-in, 4-terminal aluminum electrolytic capacitors are the robust, high-power capacitance solution EV chargers need for the DC-link capacitor bank. The 299 PHL-4TSI capacitors offer an improved ripple-current capability at an ambient temperature of 105 °C, with a useful life of 5000 h. This high ripple-current rating, which ranges from 2.45 A to 6.77 A at 100 Hz, allows you to reduce component count when ripple current is the most important parameter in the specification of the capacitor bank. An extended-cathode construction ensures that even higher ripple currents can be handled when the parts are cooled with forced air or via a heat sink. The long useful life of 5000 h is equivalent to 24/7 operation over a period of more than 20 years, provided that the ambient temperature does not exceed 65 °C. Under cyclic operation, as in a fixed battery charger, the 299 PHL-4TSI series can achieve this 20-year lifetime with even higher maximum ambient temperatures.
The 299 PHL-4TSI series capacitors, which are available in can sizes ranging from 35 mm x 60 mm to 45 mm x 100 mm, have fourterminal snap-in pins suitable for soldering. This pin configuration not only provides keyed polarity, but also better mechanical stability than the two-terminal snap-in pin configuration used on capacitors with smaller can sizes Sometimes manufacturers implement the DC-link with screw-terminal capacitors that are hand-mounted on a bus bar. One can gain worthwhile cost savings by instead building the DC-link with these large-can, four-terminal snap-in capacitors from Vishay, which can be placed on a high-current PCB and mounted using a wave solder process. The characteristics of the 299 PHL-4TSI capacitors make them ideal not just for fixed battery chargers but for many other high power applications.
Heilind Electronics Senior Regional Sales Manager – South Asia Pacific, HK/JP/KR
Heilind Always Believes In Having PhysicalReady Inventory as its Biggest Asset A commitment to comply ahead and deliver customer satisfaction and retention, Heilind Electronics in a jiffy has ousted many other players in the distribution and service delivery space. The company has been the market-ruler in the AsiaPacific region for its extensive and on-the-go inventory and distribution channel for Interconnect & Electromechanical Products. In an exclusive interview opportunity, Niloy Banerjee – Associate Editor, Bis Infotech witters with Jason Siau, Heilind Electronics Senior Regional Sales Manager – South Asia Pacific, HK/JP/KR. The extensive exchange panned across the company’s QoQ quantum growth and the company’s expansion and strategies for 2018 including India as a potential market. Excerpts.
such as kitting, reeling & de-reeling and connector modifications as a service to our customers’ to help them streamline their complex supply chains issues. What are the key sectors Heilind primarily focuses into and for India what are the key offerings or market verticals? We are primarily focusing on the industrial sector in India and we aim to be their “one stop shop” service provider for them on all their interconnect requirements. Heilind has been expanding at a quantum level, being the one of the world's leading authorized distributors of connectors, relays, switches, thermal management & circuit protection products, how u see the distribution market evolving over the years? As a world leading distributor of interconnect, relays, switches, thermal management & circuit protection products , we are constantly seeing their challenges and needs to provide better services and pricing plus delivery to our customers. Distributors as the middle man must continue to innovate and value add to the needs of the customers’, we must stay ahead of competition and must be “Flexible” to the needs of both our customers and suppliers in order to stay ahead in the market How, trends like Industry 4.0 and digitalization has impacted the distribution business model and how does the company stay ahead in this vigorous changing market? We are constantly adapting to changes in the market and as a focus Interconnect products distributors, we have products that can support trends such as Industry 4.0 and digitalization as well as the whole spectrum of the markets. Once it was the physical-ready inventory and products which were the biggest assets but with e-tail business and digital marketing, data is said to be the biggest asset? How is Heilind preparing for this transformation? Heilind always believes in having the physicalready inventory as its biggest asset, we are a stocking distributor and we stock up in anticipation of the future demand. We also invest in digital marketing and make our inventory data available on the web to make
Heilind has been snowballing at a very short span of time, what are the key reasons for this major success in this growing competitive market? Heilind growth since our inception in mid2012 was attributed to our proven North American model as our differentiator to this market. We also continue to invest in resources/people and adding footprints/ offices across major Asian cities to cater to our customers’ and suppliers’ requirement in this growing competitive market. How Heilind comply in India and at large the APAC region in terms of supply chain management, local presence and service offering etc.? We comply to our customers’ needs by setting up 3 warehouses in APAC region (Hong Kong, Singapore & Suzhou) to cater to our customers’ needs on their supply chain requirements, we also have local presence in major cities in APAC to provide local sales support to our customers’ and in India we have offices in Delhi and Bangalore to provide service and support to our customers’ As a specialized distributor for Interconnect and Electromechanical products, how does Heilind see the Indian market growing in terms of demand and technology adoption? India would continue to be the magnet of growth and we are seeing our customers’ continued investment into the country, we think that India has to balance itself and adapt to technology to cater for the divergence of sectors that it has today and continues to change and adapt as the new market grow while also maintaining the current sector growth. Many companies have been cutting-down their direct sales and marketing and have opted go-to-market strategies relying on franchised distributors. What strategies and business model does Heilind practice to streamline the complex supply chains of the OEMs? Heilind itself being a franchised distributor would benefit from suppliers that prefer to rely on distributors as their go to market strategies , we would continue to invest in resources and offices/warehouses that our suppliers’ want us to be , we stock up for our customers’ to shorten their lead time as well as providing value adding services
it more accessible to the market. Unlike other distributors, Heilind has been pioneering in the interconnection and electromechanical market, is the company looking into to expand or rather explore new verticals? We are looking into the sensor market and have added new lines such as Sensata Technologies, Amphenol Sensors and TE connectivity Sensors to fuel this growth in this market and we have also hire a Sensor Business Development Manager to help explore into this new verticals. What are the vital propositions Heilind looks into before singing distribution agreements with new distributors? Question 10 , we are distributor ourselves, so this question is not applicable to us. Can you share an anecdote of Heilind’s last fiscal journey and what growth expectation and strategies is the company looking into the next fiscal year? We have manage to outgrowth our own expectation as well as that of our competition in the last fiscal year, this year we are embarking of the Mil-Aerospace and Sensor verticals as part of our growth strategies to continue to grow the company to the next level What is the key USP of Heilind which keeps them ahead in the growing competitive market? Our key USP would be to continue Heilind’s forte in the distribution of Interconnect & Electromechanical Products. We pride ourselves as a stocking distributor and we stock up inventory to cater for our customers’ future needs. We have 3 warehouses (Hong Kong, Singapore and Suzhou) to cater to our customers’ needs, shorten suppliers’ lead-times and to ensure on time delivery to them in different parts of Asia. We are also able to trade in US$ but also in the customer’s currency of choice. Customers can also order/check inventory online via our Estore for greater convenience. Lastly, How important is Indian market for Heilind and how do it foresee to expand in this bullish market? India is a very important market for us, we expect India to see double digit growth this year and we would be expanding into more cities in India by adding new offices and people.
Smart Power Plug We are becoming more conscious for Energy consumption these days and want to know the energy consumed by home appliances in addition to the total energy consumption. Understanding household energy usage is vital for the planning of energy consumption and conservation. Monitoring the consumption of appliances, the user can decide the time and duration for the optimal usage of electricity. Hence, there is a need for a device which is portable and have possibility of agile controls. In this Article, we are introducing the Smart Power Plug which has both metering and control of load. Smart Power Plug or RF Smart Plug (As shown in Figure 1) is a reference design developed by STMicroelectronics. It is a multipurpose, compact device that has the ability to measure and control electrical devices from anywhere plugged in via a standard outlet. Monitor of Energy consumption, appliances On/Off, Scheduling of load and setting of alerts can also be done using Android App available with the design.
Figure 1. Block Diagram
Key features of RF Smart Plug are â€“ 1) Smart Energy Meter design with wireless connectivity 2) BLE (Bluetooth Low Energy) 4.1 connectivity for control and metering panel : Smartphone connectivity for energy consumption dashboard, control of appliances 3) Dimming: Some loads can be controlled. For example AC Induction fan speed, Heaters, Incandescent lamps 4) Scheduling : Set the time of day for ON or OFF of the load 5) NFC interface : To configure the design, store the logs 6) Isolated USB interface for GUI and calibration : May be required during the development and calibration 7) Rated Voltage: 240 VAC, Rated Current: 12A (TYP) 8) Power rating: Up to 2400W / 12 Amps 9) Power Consumption of Plug: 0.7 Watts (Max.)
Architecture & Working Principle: RF Smart Plug is a reference design used in home-automation for IoT (Internet of Things) application. It contains all the core functionality required for a secure communication. The smart-plug is designed using STM32L443 Microcontroller based on ARM Cortex â€“ M4
core. Main features of low power STM32L4xx microcontroller are - Crystal less USB, 100 DMIPS and operating voltage from 1.71 to 3.6V. As shown in Figure 2, It has the capability of wireless connectivity over SUB-GHz or BLE and also able to measure energy parameters like power, voltage, current and
power factor using STPM32 metering IC. Microcontroller is communicating with BLE using Serial Peripheral Interface (SPI). With the help of TRIAC user can control the load whereas Isolated USB port and dual EEPROM (M24LR) are available to communicate with GUI (Graphical User Interface) and NFC (Near Field Communication). RF Smart plug has two Modes: 1) In first mode device acts as BLE peripheral device which can be connected for control along with monitoring. 2) In second mode device is a manufacturer specific beacon which is connectable and advertises its metering parameters so that multiple android smart phones can monitor the plug, but only any one of bonded device will able to connect. This application is running at 48 MHz for performance operation of device. Power consumption of device is in between 40 to 50mA. Figure 3 is showing all the sections of RF Smart Plug. In this design, all challenges
related to form factor and reliability have been taken care. Description of some other sections is as below:
Figure 3. PCB Explanation
Power Supply Non-Isolated buck converter (Refer Figure 4) is designed using VIPER06Xs. It is used with PWM operation at 30 kHz with frequency jittering for lower EMI, having standby power < 30 mW. This type of supply are ideal for the applications (like Smart Plug) where large current is not needed and small form factor is required.
Figure 4. Non Isolated Buck converter
In our design, Output of supply is set at 4.5 V. LDO LD3905 having output voltage and current are 3.3V and 500mA is used to power up all the analog and digital sections.
Figure 5.TRIAC at 50% duty cycle and ZCD
Working of RF Smart Plug
Figure 6. Functioning Principle
Figure 6 is explaining the GATT and GAP role whereas Figure 7 is describing the State Machine of the RF Smart Plug.
TRIAC and Zero Crossing Detector (ZCD) Operation TRIAC is a three terminal component that is used to control the current. It gives AC switching for various electrical system applications. In addition, they are also able to change the duty cycle of the AC voltage which is applied to the lights/load being controlled. Figure 5 is showing the status of AC voltage at 50% duty cycle and use of ZCD for dimming reference point to fire the TRIAC.
Figure 7. RF Smart Plug State Machine
Android Application: An Android Application designed by STMicroelectronics can be used to Turn On/Off the Load, Scheduling and Dimming features. User can also see the metering parameters using the same application. Please download the Android App and follow the steps as shown in Figure 8 & 9.
Figure 8. RF Smart Plug Android App
Figure 9. RF Smart Plug Android App Settings
Conclusion: Smart-Plug is a system solution for energy management and energy saving. . It has the capability of wireless connectivity over SUBGHz or BLE and also able to measure energy parameters like power, voltage, current and power factor using STPM32 metering IC. It also contains all the core functionality required for a secure communication. Therefore it provides a fast and flexible alternative to make homes smarter and safer.
SANJAY GUPTA Vice President & India Country Manager | NXP
A BETTER TERM FOR A SENSOR IS A TRANSDUCER
The future is through sensing the connected world; perhaps semiconductor industry is testing and developing solutions to reverb the last limit of sensor technology. The boundless transformation in the industrial and automotive Industry is no more in silos. A stalwart in his domain, Sanjay Gupta |VP and India Country Manager | NXP Semiconductors in a candid exchange assiduously takes us through the next big thing in sensors technology and how its Dutch heavyweight semiconductor company has named itself a bigwig in designing a holistic framework for the future-ready sensor market. Edited Excerpts. What is the potential of sensors in shaping the future of technology? The majority of today's automotive and industrial systems depend on an accurate and reliable supply of information. Sensors are now a vital part of any modern automobile design, serving many different purposes. They are instrumental in helping car manufacturers to bring models to market that are safer, more fuel efficient and more comfortable to drive. Over a period of time, sensors will also enable greater degrees of vehicle automation, which the industry will benefit from. Sensors and analytics will alert users and vendors to problems beforehand, which will eliminate many maintenance checks, thereby helping companies save time and money. They will also allow businesses to learn how customers are using their products, which will help shape their products accordingly. Many sensor manufacturers are making a big push on innovation of new sensor technology. Sensor fusion, which has been focused by many, is a process by which data from many different sensors are “fused” to compute something more, that could be determined by any one sensor alone. This allows for an improvement in application or system performance. Radar-based ADAS will have a steep penetration over the next few years with IHS Research estimating that the market will grow to 50 million radar sensors in 2021, a 23 percent year-on-year increase from today.
Moving on from sensors, the next frontier is “actuators, what applications and sectors are the early adopters of this nascent technology and how your portfolio is catering the respective demands? Driven by new innovations in materials and nanotechnology, sensor technology is developing at a never before seen pace, because of increased accuracy, decreased size and cost, and the ability to measure or detect things that weren’t previously possible. In fact, sensing technology is developing so rapidly and becoming so advanced that we will see a trillion new sensors deployed annually within a few years. A better term for a sensor is a transducer (a physical device that converts one form of energy into another). A type of transducer that you will encounter in many IoT systems is an actuator. In simple terms, an actuator operates in the reverse direction of a sensor. It takes an electrical input and turns it into physical action. In typical IoT systems, a sensor may collect information and route to a control centre where a decision is made and a corresponding command is sent back to an actuator in response to that sensed input. Actuators are everywhere. They can turn up in the most unexpected places; from inside your cell phone to the Mars Rover. NXP motor controllers and actuator drivers offer rich possibilities for every UAV application. The breadth of the portfolio allows developers to balance the right cost, target
performance and security requirements. If processors are the brains of the system, then MOSFETs are the muscle, converting intricate control signals into precise, powerful motion. NXP’s high-performance power devices offer the perfect combination of reliable, high current performance in small, lightweight packages. Available in a range of voltages to suit all battery configurations. The key sensors technologies which will rule the technology front market? It’s tough to get consumers to adopt innovations—and it’s getting harder all the time. As more markets take on the characteristics of networks, once-reliable tools for introducing new products and services don’t work as well as they used to. The efficacy of advertising, promotions, and the sales force has declined; it is more difficult for innovators to rise above the din of information from competing sources; and only hard-to-manage relationship skills seem to make a difference. The world is getting more and more connected, and the Internet of Things (IoT) is playing a big part in changing the way we live with applications such as the smartwatch and smart home automation. IoT brings convenience to our finger tips, while making our lives safer and more efficient. By 2020, it is estimated that some 30 billion devices will be connected by the IoT. To keep up with these evolving technology trends, consumers are constantly seeking the next new IoT innovation. We live in an era of smart connectivity, where
used by a FIDO authenticator, the biometric information is securely stored in the device. Does miniaturization bring limitations in terms of precision, product reliability, performance, amid the growing demand of nanotechnology? Most of the electronic devices produced today in the world use a kind of computer chip or microprocessor in their components. The scientists are asking themselves how further we can push back the miniaturization process, to create smaller, cheaper, and faster chips. Researchers say there is plenty of scope to push back even more the limits of miniaturization. Historically, logic product offerings consisted of quad, hex and octal standard logic gates, inverters, and buffers. Entire applications were built from these building blocks. As greater integration and miniaturization occurred, the demand for logic solutions continued to grow, but shifted toward “glue” or “control” logic. With the shift to control logic applications, engineers left much of the standard logic solution unused, often only using one or two of the four logic gates in a quad device. There is plenty of discussion these days about ‘wearable technology’, and many consumer electronics companies have ventured into the market with a range of offerings. Everything, from ‘smart watches’ and augmented reality glasses, to t-shirts printed with graphics that respond to sound. Many of these are still in their infancy or are destined to be short-lived gadgets, and so far, none of these products can be said to have made a significant impact on consumers. What is the market today of sensors in India and which key sectors are driving this technology? As markets and industries continue to evolve, connectivity and security will play a greater role in their evolution. The term Internet of Things (IoT) has been used quite extensively to express today’s world of consumer and industrial products. Sensor systems and electronic instrumentations are highest growing and upcoming segments in the semiconductor market. They have a vast array of applications in electronics, industrial automation, avionics and military, mobile devices, consumer electronics, building and infrastructure, medical equipment, security, transportation, IT infrastructure and communication. Advancement in technology and miniaturization of devices has driven
our electronic devices are equipped to perform even more tasks that keep us connected. Now automakers are bringing more personalization and connectivity to your car with smart keys. Whether it’s about autonomous cars or the next fitness band, the top automakers and gadget designers understand how consumers are connected to their digital lives and that’s redefining our notion of mobility. Do sensors bring an alarming call towards more critical security challenges? To add, what safety standards are coming in front and how your company matches to deliver high-quality safety-first products? Sensor networks provide tremendous potential for information collection and processing in a variety of application domains. Like most of us, you probably have a pocketful of keys, FOBs, scan cards, and a bunch of passwords and proprietary smart phone apps to gain access to your office, home, car, smart locks and even thermostats. It would be ideal to know that every device maker implements effective security to avoid hacks and clones. But that’s not always the case. Instead, they typically invent their own proprietary authentication systems. It is focused on providing growth advisory services to mid-sized tech firms, which is where their collaboration with Systech fits in. A standard-based strong and secure authentication exists called FIDO. Working with Volansys and SurePass ID, a set of FIDO libraries help IoT embedded device makers add FIDO ulti-factor authentication to their device via one of many FOB form factors or a smart phoneapp. There are plenty of consumer advantages of widespread FIDO strong authentication use. Starting from one authentication “thing” in your pocket to super security to pick your personal FOB/Phone/ Smart Card implementation mechanism. As a design engineer, if you use FIDO strong authentication for your smart devices, you’ll find no need to “reinvent the wheel” or become a security expert; decreased development, test, and security certification time; and reduced risk that your implementation can be exploited. FIDO products and services erase the necessity of using passwords for security by adding FIDO U2F secondfactor devices. Password usage can also be completely eliminated through FIDO UAF biometric solutions such as fingerprint or iris recognition sensors. If biometric data is
the market growth in recent times. Sectors such as biosensors, image sensors, position sensors, and accelerometer are expected to show a rapid market growth. Increased adoption of gyroscopes and accelerometers in consumer electronics coupled with innovative applications including gesture recognition, biometrics, motion sensing have opened up new avenues for sensor market. In addition, availability of cheap labour, low manufacturing cost and prevalence of original equipment manufacturers (OEM) has positively driven the sensor market in developing economies. Lastly, semiconductor companies are developing the foundation of how sensors are being developed, designed as per matching standards. Is there still a lack of ecosystem in the fabrication and what key facets will keep them ahead in meeting the ‘Sensor’ first world? Smart concrete is where the projected big numbers for IoT can start to add up. A single large bridge could have several thousand embedded sensors measuring vibration and linear displacement (cracks). Crack sensors are only one type of sensor. Add in sensors for ice, liquid on pavement, pollution, noise, weather, and vehicle presence, and the count will only go up. Follow-up in a few years with more advanced sensors for use with autonomous vehicle networks, and some of the “hype” numbers being thrown around for IoT seem completely believable in the next 10-20 years. Challenging will be the sensors used from the infrastructure side in conjunction with Advanced Driver Assistance Systems (ADAS) and autonomous vehicles which will require real-time capabilities similar to industrial automation. The good news is a lot of innovation and engineering work still remains to be done, and many of the pieces will be coming together for smart concrete. Super low power nodes with secure low power lossy connectivity, long term support commitments, scalable gateway technology with the ability to manage millions of nodes, hard real-time support for vehicle control and industrial automation are part of our product portfolio today. Add in some of our continued investment in key areas such as fail safe over the air upgrades including ROM’d boot code, security with comprehensive tamper detection and crypto acceleration, advanced sensor fusion, and low power connectivity with high density ZigBee and 6LowPAN support, and it all seems possible.
TOP CRM TRENDS IN 2018
Limesh Parekh | CEO | Enjay IT Solutions
With the fast evolution of technology and its innovative implantation to drive business intelligence, it is imperative to understand the key developments in the area. CRM or Customer Relationship Management has seen a marked growth in 2017, recording widespread acceptance and adding several innovations to its structure. Being perceived now as an essential standard business procedure, CRM in 2018 can get a grand transformation. Listed here are some of the key trends to look out for: Agile Solutions With the fast paces business technology, CRM in 2018 will move to become an agile platform, retaining strong core functionalities and enabling organisations to react and adopt to varied business landscapes faster. Being agile will also include features related to other key dynamics, like changes to reflect changed consumer behaviour, renewed target group, new service structure or pilot projections etc., all of which can be temporarily or permanently be adjusted, in a short span of time, to suit the need of the hour. Mobile CRM and Social CRM applications are already leading the way to agile CRM structures and the trend is set to see multi-scale growth. AI driven Relationship intelligence With machine lear ning and ar tificial intelligence finally coming of age, with ready to use everyday functions, it is not long before the big data driven consumer insights are replaced by ‘Relationship Intelligence’ powered by AI driven algorithms. While businesses are betting on Big Data to drive sales, marketing and a host of vital business functions, its convergence with AI can drive insights to a new realm of opportunities, transforming the entire approach of consumer engagement and interaction, at every level. Pegged to be available as a SaaS/ Cloud service, the ‘relationship intelligence’ is touted as the next big CRM ace card, set to reinvent business approach among both B2B and the B2C organisations. CRM design driven by Subscription Economy The past few years saw the emergence
of a ‘subscription’ economy, with quality services- from entertainment to transport being essentially consumed through this model. Although renewable contracts as a phenomenon is yet to invade all key segments, it has become a strong factor affecting consumer satisfaction and long terms loyalty. Customer service has thus evolved as a prominent game changer, driving CRM processes to focus more on rich insights that have a pulse on consumer mood and dynamic retail sentiments. With sophisticated tools for data analytics and superior machine learning driving automated marketing processes, CRM in 2018 will see a transformation from being a tool of consumer engagement to an essential business process driving growth while managing profitable business sentiments amidst the target audiences in an increasingly dynamic market reliant on recurring revenues. GDPR driven Cloud Platforms Cloud computing, in the IT industry, has been one of the most widely received offering, transforming business processes for smaller and medium enterprises and start-up’s. With the advent of a security savvy global clientele, introduction of General Data Protection Regulation (GDPR) and variants in Private and Hybrid cloud set up’s, CRM is undergoing a massive transformation with several permutations and combinations to cater to specific needs of global businesses of all sizes. As more sophisticated cloud concepts evolve, and the CRM SaaS finally comes into play in 2018, diversification of Cloud offerings and its viable integration
for CRM processes is set to drive CRM penetration among new age businesses. Mobile Applications for Remote workplace With business concepts becoming more agile, transforming the work-life balance and flexible work spaces that allow for performance driven modern workforce, CRM too is adopting to offer solutions that are versatile and mobile. Further, with the wide availability of internet and rise in use of wireless, smart devices integrated with new age telecommunication applications, has taken the physical equation of presence for business out of the picture, making CRM too adopt to mobile platforms. While 2017 did see a rise in the mobile CRM application, 2018 will see a much more mature, agile and user-friendly acceptance from executives, with CRM being a constant companion on the filed with them for instant data capture, rather than being a dread documentation process within the confines of the cubicle. Cessation: As modern, cutting edge technology finally comes to application, impacting day to day living experiences, CRM too will be one of the major applications impacted positively and extensively with the integrated approach of these technologies and is expected to undergo a massive transformation. Even as businesses begin to brace themselves with the massive tech revolution, CRM is something that can provide a strong and rooted stability, despite the chaos, and help emerge as a prominent game changer in how businesses can holistically consume technology.
GANESH MOORTHY President and Chief Operating Officer | Microchip Technology Inc. 2018 Fast Forward Microchip Expert Power Packs the Semiconductor Industry Microchip Technology from the time of its establishment has catered the global electronics industry with its innovation, technology and upfront market strategy. The company has been pioneering in microcontroller, mixed-signal, analog and Flash-IP solutions. To the extensive outlook for the complete semiconductor industry, veteran and well-known stalwart Ganesh Moorthy | President and COO of the company traverse through the trends, technology and their companyâ€™s consolidated outlook for 2018. Edited Excerpts. How did the semiconductor industry and
to lead the industry growth in 2018? How
shortage of competition in the markets and
The semiconductor industry had a very
remains to manage for consistent growth and
that was broad-based. Microchip also had a
and IoT markets are likely to be the stronger
108 consecutive quarters as of September
very strong year with growth that was even
end markets in 2018, and we are extremely
higher than the industry as we saw growth
well positioned to capitalize on the growth
in all product lines, all regions of the world
opportunities from these and other markets.
and all end markets.
Our approach is to be a Total System Solution
What are Microchipâ€™s views on the global
provider to our customers, bringing together
Microchip perform in 2017?
strong year in 2017 with double digit growth
does Microchip prepare itself to seize
product lines we compete in. Our approach
We expect that the Industrial, Automotive
profitability (Microchip has been profitable for
semiconductor industry in 2018?
our broad portfolio of solutions to enable
We believe the semiconductor industry will
our customers to grow through innovation,
continue to have many growth drivers that
reducing overall system costs, and achieving
will be present in 2018, although we believe
fast time to market.
that growth will be at a less torrid pace than
What are some of the challenges Microchip
what we saw in 2017. What in your opinion will be the key products, applications and technologies
2017). We continue to invest in bringing innovative new solutions to the market, providing outstanding technical support to our clients, adding manufacturing capacity to support our customersâ€™ growth, providing individual products as long as there is demand (customer-driven obsolescence vs End of Lifing) as a service to our customers, and utilizing value engineering where possible to address cost reduction requirements.
and the industry will possibly face in 2018 and how would you tackle them?
Despite the consolidation, there is no
SMART GRIDS OVERCOME
RENEWABLE ENERGY VARIABILITY & UNCERTAINTY Smart grids—modernized networks that enable bidirectional flows of energy and use two-way communication and control capabilities, and “distributed generation”— will address the variability and uncertainty of RE without utilities having to add to their conventional power stations.
their manufacture and maintenance than
a wind farm might reliably produce power
they save in producing their electricity
for 40 percent of the time, just when that
and suggest instead storing the carbon
power will be produced is very difficult to
that conventional power stations emit so
predict. The challenge becomes greater
we can carry on using them.
as the proportion of RE as part of total
However, most developed nations have
generating capacity increases.
policies that mandate an increased
Uncertainty and variability of supply is a
proportion of RE. The U.S., for example,
nightmare for utility managers because
benefits from the Renewable Electricity
they undermine reliability—a lack of
Renewable Energy (RE, which includes
Standards that have been developed by
which incurs harsh financial penalties
hydro, biomass, and geothermal as well
36 states, which on average set targets
as the more familiar photovoltaic (PV)
for 20 percent of total power consumption
The electricity industry uses two indices
and wind) faces it critics. At one end of
from RE by 2020. Elsewhere, Germany is
to measure reliability:
the spectrum are those that argue global
well on the way to achieving a 35 percent
• The System Average Interruption Duration
warming is a conspiracy designed to play
contribution from RE by 2020 and China
Index (SAIDI) reflects the average number
into the hands of politicians and major
generated 23 percent of its electricity
of minutes per year that customers are
financial institutions so there’s little reason
from RE in 2014.
not to continue burning fossil fuels in our
The downsides of RE are variability (for
• System Average Interruption Frequency
power stations. Others with a less extreme
example, change of generation output
Index (SAIFI) reflects the average number
viewpoint concede the Earth is warming
due to fluctuations of wind or sun) and
of actual outages customers experience
and carbon emissions probably don’t help
uncertainty (the inability to predict the timing
but insist nuclear power (fission today
and magnitude of changes in generation
In 2007 (a good example because the
and fusion tomorrow) will save us. Still
output). As such, there is no guarantee
proportion of RE was much lower than
others claim that solar panels and wind
that RE resources will be available when
today) the U.S. had an average SAIDI
turbines produce more carbon during
demand peaks arise. For example, while
(across all electricity utilities) of 240 and
SAIFI of 1.5. Put another way, the power
utilities to “hedge their bets” by backing
was on 99.964 percent of the time. Germany
up RE with conventional generation.
fared even better that year, with power
For example, a recent example of wind
available 99.996 percent of the time.
plant experience in the U.S. showed that
To ensure such reliability, conventional
conventional reserves have been increased
electricity systems are planned around
up to 9 percent to accommodate wind
historical and anticipated demand. Large,
penetration of 15 percent. Although such
centralized baseload plants—which handle
policies increase both cost and carbon
most of the “round-the-clock” electricity
emissions, no one wants to be blamed for
requirements and are typically coal- or
blackouts caused by lack of wind or sun.
uranium-fueled—provide large amounts of
Tomorrow, smart grids—modernized
consistent, inexpensive power. Intermediate
networks that enable bidirectional flows of
load plants are generally combined cycle
energy and use two-way communication
natural gas plants and can be ramped-up
and control capabilities, and “distributed
and -down but are most efficient when they
generation”—will address the variability and
run for a number of hours. Baseload and
uncertainty of RE without utilities having to
intermediate load plants are supplemented
add to their conventional power stations.
by gas- or oil-burning power stations during
Building smart grids takes time, but
times of peak demand. These plants can
the good news is that this can be done
increase or decrease output very quickly,
without interrupting current RE initiatives.
but are not particularly efficient.
A study by the National Renewable Energy
Today, this emphasis on reliability causes
Laboratory (NREL) in the U.S. found that
Steven Keeping gained a BEng (Hons.) degree at Brighton University, U.K., before working in the electronics divisions of Eurotherm and BOC for seven years. He then joined Electronic Production magazine and subsequently spent 13 years in senior editorial and publishing roles on electronics manufacturing, test, and design titles including What’s New in Electronics and Australian Electronics Engineering for Trinity Mirror, CMP and RBI in the U.K. and Australia. In 2006, Steven became a freelance journalist specializing in electronics. He is based in Sydney.
integration of 35 percent of wind and solar
energy into the electric power system— saving carbon emissions approximately
equivalent of taking 22 to 36 million cars off the road—will not require extensive new infrastructure if changes are made to operational practices. Key to making this happen is increasing the geographic area over which the wind and solar resources are drawn to substantially reduce variability. But once RE penetration approaches 50 percent smart grids will be needed to underpin future reliability. Such networks will knit together hundreds of small generators such as PV panels on domestic roofs, windfarms and tidal generation with stored energy schemes such as water pumped uphill when electricity is plentiful and released to power turbines when it’s not. This distributed generation will be sited closer to population centers than today’s giant power stations, shortening transmission and distribution feeders (the poles and wires) and reducing both their cost and the power losses associated with them. In practice, rapid communication technologies will warn operators of, for example, approaching clouds allowing a smooth transition from PV to stored water generation, using Intelligent Electronic Devices to switch the direction of power flow and then change it back again when the sun reappears. There are some major engineering and security challenges to be resolved, and considerable investment needed, before nationwide smart grids are rolled out. But if we shy away from these challenges, we’ll forever be trading-off the benefits of clean power against reliability of supply and providing more ammunition for the climate-change sceptics.
TEST & MEASUREMENT 26 BISINFOTECH.COM
Anritsu Announces Advancement in 5G Sub-6 GHz Measurement Anritsu Corporation has announced the expansion o f t h e c o m p a n y ’s Universal Wireless Test Set MT8870A software. The new upgradation is sought to support the new 3GPP 5G Sub-6 GHz New Radio (NR) RF measurement standards. Using the developed 5G Sub-6 GHz NR Uplink Tx Measurement and Downlink Waveform File software options will support non-signalling based 5G Sub-6 GHz TRx tests. 3GPP Release 15 was announced in December 2017 defining the 5G NR standards. Apparently national telecom operators are targeting early 2019 for rollout of commercial 5G services and have announced an accelerated timetable for practical trials. With a seamless frequency band up to 6 GHz and a bandwidth of 160 MHz as standard features: • The advanced MT8870A platform does not require hardware upgrades to support the 3GPP 5G Sub-6 GHz defined test conditions, enabling users to expand functions for 5G Sub-6GHz NR while minimizing upgrade cost risks. • The MT8870A is a popular tester for mobile devices, featuring industry-best measurement speeds and customized turnkey solutions. • Adding support for 5G Sub-6 GHz NR measurements will help play a key role in smoothing deployment of advanced cellular wireless technologies. The Universal Wireless Test Set MT8870A is a measurement platform for mass-production of various wireless communications equipment and modules. The main unit accommodates four high-performance test units, each operating completely independently to perform measurements of up to four pieces of wireless equipment or modules in parallel. Adding the released software expands the MT8870A functions to support the 5G Sub-6 GHz tests defined by 3GPP Release 15 (Tx power, frequency, modulation accuracy, Rx sensitivity, etc.) with automatic, fast measurements. In addition, this powerful MT8870A platform supports continuous line testing of next-generation mobile devices incorporating 4G + 5G + 11ax + Bluetooth 5 technologies to help cut production-line testing costs. Key Markets and Applications • Target Markets: 5G Chipset vendors, module vendors, and finished-product vendors • Applications: PHY layer (RF) tests of 5G equipment and devices Although the 3GPP 5G NR standard defines use of frequency bands up to 52.6 GHz, early deployments will be focused on the Sub-6 GHz spectrum (frequency band below 6 GHz), which has the merit of offering services with frequencies near 4G LTE, such as mobility and wide area coverage, where 5G is expected to play the main role until around 2020. Support for this Sub-6 GHz standard is expected to be the first step for vendors of 5G devices, such as smartphones.
Keysight Technologies rolls out new PathWave – an industry-first software platform that integrates design, test, measurement and analysis. PathWave is touts to be based on Keysight's industry-leading, proven expertise to ensure consistency, accuracy and measurement integrity. The software platform provides customers with flexible and immediate access to the design and test tools they need, when they need them. The interoperability of the design and test tools and advanced data management significantly speeds the product development cycle, eliminating the need to re-create individual measurements and test plans at each discrete stage of the process. With all the innovative ingredients integrated, PathWave enables customers to accelerate innovation and product development from concept through manufacturing and deployment. PathWave is an open, scalable, and predictive software platform that integrates hardware and software at every stage in the product development workflow. It combines design software, instrument control, and application-specific test software in an open development environment allowing users to create highperformance solutions fast. • Open. PathWave connects and integrates all design and test resources: o Provides open APIs which allow for simplified and rapid customization o Easily integrates best-in-class technology, including 3rd party software and hardware o Quickly connects compatible hardware to speed test workflows and enhance productivity • Scalable. PathWave offers flexible computing power that scales to meet varying workloads: o Operates locally, in the cloud, or both to accelerate design and test computations o Processes test data across the workflow, locally or in the cloud o Saves transition time between development phases in your design and test workflow • Predictive. PathWave provides powerful analytics tools for faster troubleshooting: o Quickly delivers comprehensive data analytics to identify trends and troubleshoot issues o Monitors the utilization and health of each test resource for improved productivity and scheduling o Captures and analyzes big data for faster, more effective workflow processes "We all recognize the many societal benefits offered by technology, from cloud computing, big data, machine learning, and artificial intelligence, to augmented reality, and various types of mobile platforms," said Jay Alexander, senior vice president and chief technology officer at Keysight Technologies. "But gaining the full value of these new technologies requires deep expertise across the whole design and test workflow, plus the measurement expertise to effectively implement them. Keysight is committed to continuously complementing emerging technologies with solutions that help our customers overcome barriers to innovation and establish efficient workflow processes." PathWave offers a set of integrated software products for the entire design, test and verification workflow. These products are connected, interoperable, and rapidly reconfigurable, delivering the industry's most efficient workflow that enables customers to: • Allocate the right computing resources where and when needed • Evaluate collected data to optimize workflow • Ensure new hardware and software works with existing hardware to maximize ROI • Predict bottlenecks and rapidly correct to ensure efficient workflow process • Review project status from anywhere to maintain completion commitments
TEST & MEASUREMENT
Keysight Technologies Rolls out First Design, Test Software Platform Integrates Simulation, Design, Test Workflows
TEST & MEASUREMENT
FLIR New Thermal-Equipped Concrete Monitoring Solution Engineered for Construction Industry
FLIR lately unveiled the intelliRock III concrete profiling solution for construction professionals. Now in its third generation, the latest intelliRock from FLIR adds thermal imaging capabilities powered by the FLIR Lepton thermal micro camera core. Key Features include: The new intelliRock III provides instant access to data and alerts to ensure maximum concrete quality. With integrated thermal imaging technology, professionals can now visualize concrete to detect delamination, monitor insulation performance, and view curing box and specimen temperatures and other temperature extremes. intelliRock III is the only system available to retain secure, uninterruptable, and unalterable data, from start to finish. It also delivers real-time information needed for safer and more efficient management of concrete-related workflow with 4G LTE wireless capability and Bluetooth functions. A sliding-scale logger comparison helps ensure differentials are accurate to prevent thermal cracking and potential structural defects, which can all be viewed remotely. Additional Info: FLIR is showing the new intelliRock III this week at the 2018 World of Concrete Show in Las Vegas.
GW Instek Launches New PFR-100 Fanless Multi-Range D.C. Power Supply GW Instek launches the PFR-100 series, a small and high-performance programmable D.C. power supply, adopts natural convection design to dissipate heat. The fanless structure touts to allow users to focus on their experiments and tests in a quiet environment. Fanless power supply will not suck in dust and foreign objects, therefore, PFR-100 has a longer life cycle compared with that of power supplies with fan. Key Features • The PFR-100 series is a power supply with a five-fold rated power that allows users to self-define voltage and current under rated power conditions so as to satisfy them with wider voltage and current operational ranges. • PFR-100, with rated 100W, provides two models: PFR-100L- maximum output voltage of 50V (at 2A) or maximum output current of 10A (at 10V); PFR-100M- maximum output voltage of 250V (at 0.4A) or maximum output current of 2A (at 50V). • The PFR-100 series provides front and rear panel output terminals. • The front panel output terminal helps users shorten test lead replacement time while conducting adjustment on front panel’s function keys. • The rear panel output terminal facilitates an easy wiring operation for rackmount assembly. • 3U height, 70mm width and 2.5KG in weight have greatly elevated PFR-100’s portability. • Furthermore, the multi-drop mode allows users to control up to 31 PFR-100s without using switch/Hub that help users save the equipment cost.
Rohde & Schwarz announces successful completion of a project at RTL II that sees its R&S PRISMON IP-based platform provide comprehensive AV content monitoring and multiviewer facilities on a new and radically different OTT cannel playout. By Integrating R&S PRISMON within a Nevion VideoIPath SMPTE 2022-7 video routing system and a HMS channel-in-a-box server, RTL II can playout a linear content stream with commercial spots delivered by an internet-based ad server. The stream can be viewed on iOS and Android devices as well as on Fire TV and browsers. The App enables time-shift and direct access to RTL II’s VOD section. For the first time RTL II’s OTT channel playout and monitoring is to be entirely IP-based: R&S PRISMON supports 2022-7 signals as well as OTT and TSoIP streams, such as UDP and HLS. This facility means that as RTL II expands its OTT services, its staff can monitor and control a range of broadcast signals and internet streams on the same device without any external converters. This helps RTL II to ensure that all its media outputs – both broadcast and OTT – are high quality. In the event of R&S PRISMON detecting an error in the main channel, it is easy for the broadcaster to switch to a back-up playout server. Another influencer in RTL II’s decision to select R&S PRISMON is the platform’s ability to future-proof its business growth plans. “R&S PRISMON is essentially a software-based product. Its concept of licenses for the available services make future implementations straightforward. For example, SMPTE 2110 will be supported if we need it in our future infrastructure. A service level agreement with Rohde & Schwarz gives us access to the future developments and firmware updates, and also ensures all the technical and operational support we need. This is very important for us, especially during the implementation period of the new SMPTE 2022 technology,“ Dirk Kolditz explains. R&S PRISMON AV content monitoring and multiviewer R&S PRISMON is an IP-based convergent monitoring solution for broadcast and streaming media/OTT. It offers multi-standard support including SDI, SDIoIP, AIMS/SMPTE 2110, TSoIP and OTT upload/download. Its future-ready, fully software defined architecture enables innovative, powerful monitoring functions such as LiveQM and Content Compare. The platform features an orchestration-ready design for dynamic and flexible resource allocation in virtual environments. R&S PRISMON is available both on scalable IT hardware platforms and for cloud deployments.
Innovative Testo 440 Air Velocity and IAQ Data Logger for IAQ Experts Testo launches a new air velocity and IAQ data logger. The new rollout of TESTO is claimed as a new innovation for indoor air quality (IAQ) specialists. The Testo 440 air velocity and IAQ measuring instrument touts to mitigate some of the clutter associated with existing systems, enabling heating, ventilation and air conditioning (HVAC) engineers to do more with less using a modern tool.
TEST & MEASUREMENT
Rohde & Schwarz Monitoring and Multiviewer Solution Tweaks German Broadcaster RTL II
‘Smart LED’ Firm iBahn Illumination Rollsout AppEnabled PRIMA and ELITE Series
iBahn Illumination, the first company in India to specialise in Smart LED lights announces the launch of its PRIMA and ELITE Series of spotlights. They are the country’s first app-operated chip-on-board (COB) lighting solutions. PRIMA Offers: • Reflector-based spotlights with fixed and adjustable spots. • ELITE is a lens-based spotlight with a modular design of four different reflector attachments – Fixed, Swing, Angle and Curve. • Priced between INR 2,000 and INR 5,000. Available in 8W and 16W, Bright and Dim (Prima), and Warm and Cool (Prima and Elite) lighting options, which allow customers to control the dimming and colour temperature as per their requirement. Compatible with Android and iOS, the spotlights provide exceptional indoor lighting and can be applied in spaces such as the living room, bedrooms, in POP ceilings for home, corridors, showrooms, cafeteria, restaurant, hotel lobbies, reception areas and in recessed gypsum ceilings.
LED Bulbs Reduces 570Mn Tons of Carbon Emissions in 2017
The potential and technology of LEDs today is a headline. The market LEDs have created is bullish and complimented by every sector – may it be Automobile and Gadgets or Industrial and Smart Cities - everything takes a foreword towards LEDs. With falling prices of LEDs and the beauty it radiates is well accepted by worldwide customers. But the major facet of LEDs it lauds Green Energy and help diminish the carbon emission. IHS Markit, a global research firm in its latest study states 570 million tons of carbon dioxide emissions were reduced thanks to the use of LED bulbs. This is an amount similar to shutting down 162 coal-fired power plants around the world. LED component and lighting companies were responsible for reducing the global carbon (CO2e) footprint by an estimated 1.5 percent in 2017, and that number is likely to continue to grow as more LEDs are installed around the world. LEDs have other positive environmental benefits, too. For example, LEDs have a longer life span than traditional bulbs and fewer are produced, so the emissions and pollution associated with the production, shipping, sale and disposal of the products is lowered. Secondly, unlike fluorescents, LEDs do not contain mercury. LEDs also decrease air pollution, since most electrical energy is still generated by burning fossil fuels. “While other activities affect climate change more than lighting does, it is still a very strong contribution from a single industry sector,” Fox said. LEDs use 40 percent less power than fluorescent light bulbs and double that amount for incandescent lights. Instead of looking toward wattage, a better measurement for LEDs is lumens. To achieve a bright level of 2,600 lumens, incandescent bulbs would need 150 watts while LEDs only require between 25 to 28 watts. This also makes LED lights more efficient and gives them the ability to last far longer than traditional bulbs. Since they can last up to 20 years in some cases, this would decrease production of bulbs, eliminating emissions from the process and creating less waste. LEDs also don’t contain mercury like fluorescents do.
Quantum Dots Hold LEDs ‘Bright’ Future
Researchers have been studying quantum dots in order to find a low-energy means of reproducing light in every color visible to the human eye and at a very bright luminescence. Given the success of the research, the quantum dots should provide the basis for a new generation of light-emitting diodes. Making lights to last for longer and remain bright is an important backdrop for the development of many modern LED technologies. A type of quantum dot could well hold the answer to improving LEDs with quantum dots. An international research team led by ETH Zurich and IBM Research Zurich is working on a technology - a class of nanocrystals that have the ability to shine a range of very bright colors. The nanocrystals are formed from caesium lead halide compounds. One reason for the crustal properties is due to the molecular arrangement; here the crystals are arranged in a perovskite lattice structure. This enables the researchers to alter the emission wavelength by tuning both size and composition of nanoparticles. Part of the special properties of the quantum dots comes down to the nanocrystals emitting light very quickly. The caesium lead halide quantum dots are capable of emitting light at room temperature after just one nanosecond. Lead researcher Professor Maksym Kovalenko managed to create the nanocrystals from semiconductor material. Speaking with his university's website, the scientist states: “These tiny crystals have proved to be extremely bright and fast emitting light sources, brighter and faster than any other type of quantum dot studied so far.” He goes onto explain how, by varying the composition of the chemical elements and the size of the nanoparticles, the researchers succeeded in producing a range of nanocrystals that can light up each of the colors across the visible spectrum. The quantum dots can be controlled through the application of photons, used to excite semiconductor nanocrystals in an array. This forces an electron leaves its original place in the crystal lattice, leaving behind a hole. Illumination can also be controlled, since under given conditions, an electron hole pair is unable to revert to its energy ground state and therefore the light emission is suppressed and occurs delayed. The research has been reported to the journal Nature. The research paper is titled “Bright triplet excitons in caesium lead halide perovskites.” The primary application of the quantum dots will be with a next generation of light-emitting diodes for larger displays.
A Major Breakthrough - LEDs Make Wheat Grow 50pc Faster To feed the burgeoning population, a team of scientists has found a way to grow wheat 50% faster through LED lights. Experts believe that the applications and innovations of LEDs are far more beyond than just emitting green light. This latest breakthrough is known to be a LED revolution for the horticultural industry. Researchers from Australia and the UK grew wheat from seed to maturity in just eight weeks instead of the standard 16-week growing time for the cereal grown in spring. The “speed-breeding” regime developed by teams at the John Innes Centre in Norwich, UK, in conjunction with the universities of Queensland and Sydney, uses a glasshouse with LEDs tuned to aid photosynthesis in wheat and illuminated for up to 22 hours a day. The development means that, for the first time, it is possible to grow as many as six generations of wheat every year, a threefold increase on the shuttle-breeding techniques currently used by breeders and researchers. The success of the project is being compared to the post-World War Two shuttle-breeding innovations in cereal production. “Globally, we face a huge challenge in breeding higher yielding and more resilient crops,” the leader of the team, Dr. Brande Wulff of the John Innes Centre, told Lux. “Being able to cycle through more generations in less time, will allow us to more rapidly create and test genetic combinations and find the best combinations for different environments.” “I'd like to think that in 10 years from now, you could walk into a field and point to plants whose attributes and traits were developed using this technology,” says Dr. Brande Wulff of the John Innes Centre, pictured, of the LED lighting regime that has dramatically boosted wheat growing times. (Photo credit: John Innes Centre 2017.) Despite a rapidly growing world population and the impact of climate change, the improvement rates of several staple crops have stalled in recent years. Speed breeding, says Dr. Wulff, offers a potential new solution to a global challenge for the 21st century. “People said you may be able to cycle plants fast, but they will look tiny and insignificant, and only set a few seed. In fact, the new technology creates plants that look better and are healthier than those using standard conditions. One colleague could not believe it when he first saw the results. “I’d like to think that in 10 years from now you could walk into a field and point to plants whose attributes and traits were developed using this technology.” The international team also says it has proof that the speed-breeding technique can be used for a range of important crops. They have achieved up to six generations per year for bread wheat, durum wheat, barley, pea, and chickpea; and four generations for canola, a form of rapeseed. This is a significant increase compared with widely-used commercial breeding techniques. A control experiment using high-pressure sodium (HPS) lights at the University of Queensland, Australia. The scientists say the sodium-vapor lamps are ineffective because they generate much heat and emit poor quality light compared to LEDs. (Photo credit: University of Queensland.) Speed breeding, when employed alongside conventional field-based techniques, can be an important tool to enable advances in understanding the genetics of crops, say the scientists. “Speed breeding as a platform can be combined with lots of other technologies such as gene editing to get to the end result faster,” explains Dr. Lee Hickey from the University of Queensland. The study shows that traits such as plant pathogen interactions, plant shape and structure, and flowering time can be studied in detail and repeated using the technology. The speed breeding technology has been welcomed by wheat breeders who have become early adopters. The John Innes Centre in Norwich, UK is an international center for plant science, research, genetics, and microbiology. (Photo credit: Google Maps 2016.) Ruth Bryant, a wheat disease expert at UK seed supplier RAGT, said, “Breeders are always looking for ways to speed up the process of getting a variety to market, so we’re really interested in the concept of speed breeding.” The company is working closely with Dr. Wulff’s group at the John Innes Centre to be the first to develop the method in a commercial setting.
Design 2018 Challenges for Embedded Systems Industry in
Design, system and product engineers developing Embedded products will witness more challenges in 2018. The Global Embedded Technology Market is growing with the rapid pace; mainly due to the increasing demand for low cost and reliable storage facility. According to a recent study report published by the Market Research Future, the global market of Embedded Technology is growing rapidly and expected to gain prominence over the forecast period. The market is projected to demonstrate a remarkable growth by 2027, beating its previous growth records in terms of value with a noticeable CAGR during the anticipated period. The growing demand for embedded technology in consumer electronics market and factors such as cost effectiveness and customization, is further driving growth of the global Embedded Technology Market. Key Market Players like Texas Instruments, Renesas Electronics Corporation, STMicroelectronics, Samsung, STMicroelectronics, Microsoft Corporation, Infineon Technologies AG, Renesas Electronics Corporation, NXP Semiconductors, Atmel Corporation is set to rule this Embedded Technology space. Not only will the chip industry be more vulnerable and critical, but most of the related technologies also groom with new disruptions.
Advances in processor technology will
Steady increase in EV adoption with
continue to push IoT applications, though
associated infrastructure. This will be partly
all embedded applications will benefit
fuelled by the continuing worldwide expansion
from higher performance, lower power
of the electric vehicle market, expected to
requirements, and increased connectivity.
increase by a compound annual growth rate of 21% over the next decade1. The growing number of global initiatives to tackle environmental pollution and the wider availability of low cost Li-ON batteries will also add momentum to expansion of EV infrastructure.
AI is moving quickly from research to production because it can address such a wide range of applications, including object identification—a critical aspect for applications like automotive advanced driver assistance systems (ADAS). DNN is also being used to improve handwriting recognition, noise cancellation, and much more. AI – a mix of real and gimmicky AI products being announced. Some will be devices that move the field forward; others merely a marketing ploy. 2018 should see advances in AI for crunching the vast amount of user data that is being collected also for analysing and acting upon user behaviour and habits.
STORAGE Storage technologies like Resistive RAM (ReRAM), Conductive Bridging RAM, and MRAM to hit the Embedded system shores. This means microprocessors and systemon-chip (SoC) solutions can utilize non-flash NVM technologies that offer advantages
such as speed and unlimited write lifetimes.
Bluetooth 5 and Bluetooth Mesh are separate
Texas Instruments’ MSP430 microprocessor
technologies but both have been recently
family already has FRAM versions that proffer
approved by the Bluetooth SIG. Expect to see
considerable advancement in flash-based
a rapid increase in the number of Bluetooth
solutions. Also, NVM Express (NVMe) is
5 devices over the next year. Advantages
showing up on more motherboards that
are meshing ability, increased data rate
support M.2 and U.2. SATA and SAS offer
or range and an increase in advertising
many benefits, but performance is driving
capacity. The addition of meshing in particular
adoption of NVMe.
is interesting in relation to the impact this could have on Thread and ZigBee. For end users, this should remove one of the bigger flaws in Bluetooth; its limited range.
AUGMENTED REALITY The global augmented reality and virtual reality market is expected to reach USD 151.30 Billion by 2022 at a CAGR of 70.41% during the forecast period. Virtual-reality systems with higher resolution will challenge available display and processor technology. Wireless or mobile solutions will be taxed by weight and power concerns. Gaming will remain a major thrust for VR, but more applications will be emerge in 2018.
TESTING ELECTRONIC DESIGN AUTOMATION IN 2018 -Niloy Banerjee
EDA design systems are changing with new critical smart technologies like IoT uproars in the semiconductor market. The emergence of system-in-package (SiP) technology has enabled mixedsignal SoC manufacturers to provide the single chip with more functionality at a moderate price. The global electronic design automation market is expected to be highly concentrated by the end of 2022. As the global electronic design automation market is expected to reach USD 11 billion during the period 2018-2022. According to Global Electronic Design Automation Market 2018-2022 report, one of the major drivers for this market is rising adoption of SoC technology. The global electronic design automation market is expected to be highly concentrated by the end of 2022. Vendors in this marketspace are competing based on factors such as technology, research and developmental activities, labor, and
brand. Moreover, players in the EDA market are also focusing on differentiating their products based on innovation, regulatory compliance, and quality of the products. “Systems and IP will be the watchwords in 2018 as the semiconductor design ecosystem advances from chip-centric (integration of transistors) design to systemcentric (integration of functional blocks) design,” predicted Bob Smith, executive director of the Electronic System Design Alliance (ESDA). He notes that “the move from chip-centric design to system-centric design is happening, and commercial products in the system design automation segment are starting to emerge. Another example of system-centric design is IP morphing into chiplets or hardened IP that’s characterized and tested before SoC design begins.” Growing Design Complexity to Improve Functionality The semiconductor market is defined by the
need for high functionality, performance, and bandwidth. Thus, semiconductor device manufacturers should enhance their offerings in terms of performance and functionality. They must also ensure that they maintain the time to market to gain an advantage over their competitors. The increasing complexity of semiconductor chip designs has further increased the manufacturing complexity. According to a senior analyst at Technavio for semiconductor equipment research, “The features and functionalities provided by consumer electronic devices are increasing as electronic device manufacturers are concentrating on differentiating their offerings. Semiconductor device manufacturers have addressed this need by developing new and more complex architectures and designs such as the advent of 3D architecture and MCMs.” SoC Technology Gets Omnipresent A large number of manufacturers
are integrating their devices such as smartphones, automotive body electronics, telemetry devices, wireless communication equipment, and electrocardiogram (ECG) with SoC technology. The emergence of system-in-package (SiP) technology has enabled mixed-signal SoC manufacturers to provide the single chip with more functionalities at a moderate price. The need for semiconductor devices
The electronic design automation market is witnessing considerable growth in the on-premise deployment model because onpremise software provides data execution across many business units, functions, or product lines. According to our analysts, the on-premise segment will account for the maximum share of the EDA market throughout the next few years. The latest trend gaining momentum in the market is shift from perpetual to subscription licensing model. One of the major factor limiting the growth of the EDA market is the high capital investments. The provision of EDA tools based on the subscription license model allows end-users to create a mix of desired EDA tools. End-users are eligible to receive upgrades and maintenance facilities for a specific time period. Design for High-Precision, Miniaturized Electronic Devices
There is an increase in the demand for compact electronic devices from almost all sectors, including communication devices, automotive, industrial manufacturing, and healthcare equipment. This has encouraged semiconductor IC manufacturers to increase their R&D expenditure to reduce the size of the ICs and enhance their performance. This has led to the emergence of MEMS and 3D semiconductor devices. ICs have become denser over the last decade. MEMs and 3D ICs have an increasing number of interconnects and transistors integrated into them. These ICs require finer deposition and patterning. Chip manufacturers have migrated from planar field-effect transistor designs to fin-shaped FET architecture designs. Hot IoT Giving Chills to EDA Design Internet of things is a catch 22 for many engineering projects today. Most IoT applications are prototypes and proof of concepts (PoC) designed to justify enterprise budget increases and followon venture investment rounds. Modern products must be equipped with a system that allows the end device to be linked to many other systems. A typical example is the automobile auto driving system, which is not only about cars but also involves various services of our society and daily lives. When designing a smart car, engineers must think about the car itself while also considering how this car will be able to receive and treat communication data sent by its surroundings. Today, QCD is applied to all components of a given device. One of the challenges of integrating software in a device is its dependence on exterior elements. The functional safety issues for the products are getting more and more important. Security will be a core component for these devices. Custom circuits implemented specifically for security will be implemented. Eventually, there will be a consensus about how to do this, but few companies are ready to roll their own until the full security software stack is understood.
is increasing in terms of capacity and speed. This in turn, will propel the popularity of SoC technology. This creates a need for electronic design automation (EDA) software because they ensure that the chip designs are in line with requirements. They also ensure the precision required in the design. The launch of 4G networks in several countries such as India and China has resulted in the deployment of long-term evolution technology (LTE). This technology has a significant impact on the smart devices market, leading to exponential growth of smartphones, tablets, and wearables with 3G and 4G connectivity.
Data Privacy Day 2018: Top 7 Services on Cloud that Help Ensure Data Privacy As cloud computing transforms the way organizations use, store, and share data, applications and workloads, on Data Privacy Day 2018, Microsoft reiterates its commitment to ensure that your data remains only yours, without exception. Microsoft’s industry leadership in data privacy protection has been recognized for over a decade, beginning with the establishment of its trustworthy computing principles: security, privacy, compliance and transparency, and continuing into its ongoing endeavour to create secure services that are built-in rather than bolt-on. Security and personal privacy threats are increasing in volume and sophistication every day; and more and more data and applications are moving to the cloud. This creates unique infosecurity challenges that need to be constantly addressed through the best security stack that protects data. Microsoft recommends that organizations ensure their cloud providers have the following seven services across all workloads: 1. Centralized policy management 2. Continuous security assessment and actionable recommendations 3. Advanced cloud defences 4. Prioritized alerts and incident reporting 5. Unified security and privacy management 6. Advanced threat protection 7. Mechanisms for encryption, secrets administration, and access control that can be leveraged for managing sensitive data These capabilities can combine to provide an unparalleled compliant foundation to help ensure control over the integrity, privacy, and security of your critical data. Regardless of an organization’s size or the industry, Microsoft’s Azure Security Center threat detection capabilities, alerts, and recommended fixes helps protect your cloud resources from unwanted threats. With Azure Security Center, companies can apply security policies across entire workloads, limit exposure to threats, as well as detect and respond to attacks, thus protecting organisational and individual privacy. Microsoft software development teams apply a variety of security technologies and procedures to help protect information from unauthorized access, use, or disclosure, throughout the company’s development and operational practices which revolve around:
• Privacy by Design - to enable informed decision-making • Privacy by Default - to protect by means such as access control lists in combination with identity authentication mechanisms • Privacy in Deployment - to establish appropriate privacy and security policies for users • Communications - by publishing privacy policies, white papers, and other documentation pertaining to privacy Maintaining information security and privacy is a continuous process that spans both, on-premises datacenters and your cloud environment. In 2018, cyber-security enabled privacy will be of core importance to Microsoft as they enable digital transformation of Indian business.
A new research from WinMagic found that 39% reported their infrastructure was more complex since using the cloud, and 53% spend more time on management tasks than they have done previously. Security, management and compliance challenges are impacting the benefits businesses are receiving from using the cloud as their infrastructures become more complex. A new research from WinMagic found that 39% reported their infrastructure was more complex since using the cloud, and 53%
Cloud Workloads at Risk From Security, Management and Compliance Failings - Study
spend more time on management tasks than they have done previously. Falling short on securing the cloud 98% of the 1,029 IT decision maker respondents reported using the cloud, with an average 50% of their infrastructure up in the sky. Over one third (33%) of respondents reported that data is only partially encrypted in the cloud, and 39% admitted to not having unbroken security audit trails across virtual machines in the cloud, leaving them exposed. Asked about their top three concerns on future workloads in the cloud, 58% reported security as their top concern, followed by protecting sensitive data from unauthorized access (55%) and the increased complexity of infrastructure (44%). On average companies had to use three encryption solutions to protect data across the cloud and on-premises infrastructure, illustrating one of the main ways this complexity emerges. Compliance confusion Responsibility for the regulatory compliance of data is a significant area of confusion, with only 39% considering themselves ultimately responsible for the compliance of data stored on cloud services. Worryingly, 20% believing it is solely the responsibility of the cloud service provider, whilst a further 20% believed they were covered by their cloud service provider’s SLA. Further, only a quarter (25%) of respondents have automated tools to ensure compliance rules are not broken. New legislation, such as the EU General Data Protection Regulation which comes into enforcement in May 2018, will see companies required to carefully manage the encryption, storage, use and sharing of personally identifiable information. As some people know by now, failure to comply can result in fines equivalent to 4% of annual turnover or €20m, whichever is the greater. Companies should already have
an appointed Data Protection Officer, to ensure compliance and mitigate risks. “The stakes for companies were already high, with data breaches increasing in frequency and scale,” said Mark Hickman, Chief Operating Officer at WinMagic. “EU GDPR reinforces the care that must be taken with data. The simple fact is that businesses must get the controls in place to manage their data, including taking the strategic decision that anything they would not want to see in the public domain, must be encrypted.” Management tasks are frustrating IT teams Expanding infrastructure into the cloud has come at a cost for the majority of companies, with a greater burden on IT teams. Over half (55%) reported needing to use more management tools since migrating workloads to the cloud, sometimes needing multiple tools for the same task. Over half (53%) reported spending more time on management tasks than ever before. Asked what they would use time saved on management tasks for they said: • IT projects needed to support the business (50%) • Accelerate projects that are currently stalling (42%) • Improving security (36%) Hickman added, “At its heart, using heterogeneous cloud environments is making it harder for businesses to manage security and compliance, leaving staff firefighting rather than focusing on new projects that will benefit their businesses. Companies need to think about choosing management tools that are cloud agnostic, and remove complexity. WinMagic’s SecureDoc family of products does exactly this, encapsulating virtual machine management, encryption, and compliance across the widest range of operating systems and public or private cloud configurations.”
Massive Lacuna Between Countries on Cloud Data Protection â€“ Study Vast majority of global companies (95%) have adopted cloud services but there is a wide gap in the level of security precautions applied by companies in different markets. Latest study reveals that organizations admitted that on average, only two-fifths (40%) of the data stored in the cloud is secured with encryption and key management solutions. The findings - part of a Gemalto commissioned Ponemon Institute "2018 Global Cloud Data Security Study" - found that organizations in the UK (35%), Brazil (34%) and Japan (31%) are less cautious than those in Germany (61%) when sharing sensitive and confidential information stored in the cloud with third parties. The study surveyed more than 3,200 IT and IT security practitioners worldwide to gain a better understanding of the key trends in data governance and security practices for cloud-based services. Germany's lead in cloud security extends to its application of controls such as encryption and tokenization. The majority (61%) of German organizations revealed they secure sensitive or confidential information while being stored in the cloud environment, ahead of the US (51%) and Japan (50%). The level or security applied increases further still when data is sent and received by the business, rising to 67% for Germany, with Japan (62%) and India (61%) the next highest. Crucially, however, over three quarters (77%) of organizations across the globe recognize the importance of having the ability to implement cryptologic solutions, such as encryption. This is only set to increase, with nine in 10 (91%) believing this ability will become more important over the next two years - an increase from 86% last year. Managing privacy and regulation in the cloud Despite the growing adoption of cloud computing and the benefits that it brings, it seems that global organizations are still wary. Worryingly, half report that payment information (54%) and customer data (49%) are at risk when stored in the cloud. Over half (57%) of global organizations also believe that using the cloud makes them more likely to fall foul of privacy and data protection regulations, slightly down from 62% in 2016. Due to this perceived risk, almost all (88%) believe that the new General Data Protection Regulation (GDPR), will require changes in cloud governance, with two in five (37%) stating it would require significant changes. As well as difficulty in meeting regulatory requirements, three-quarters of global respondents (75%) also reported that it is more complex to manage privacy and data protection regulations in a cloud environment than on premise networks, with France (97%) and the US (87%) finding this the most complex, just ahead of India (83%). Head in the clouds
Despite the prevalence of cloud usage, the study found that there is a gap in awareness within businesses about the services being used. Only a quarter (25%) of IT and IT security practitioners revealed they are very confident they know all the cloud services their business is using, with a third (31%) confident they know. Looking more closely, shadow IT may be continuing to cause challenges. Over half of Australian (61%), Brazilian (59%) and British (56%) organizations are not confident they know all the cloud computing apps, platform or infrastructure services their organization is using. Confidence is higher elsewhere, with only around a quarter in Germany (27%), Japan (27%) and France (25%) not confident. Fortunately, the vast majority (81%) believe that having the ability to use strong authentication methods to access data and applications in the cloud is essential or very important. Businesses in Australia are the keenest to see authentications put in place, with 92% agreeing it would help ensure only authorised people could access certain data and applications in the cloud, ahead of India (85%) and Japan (84%). "While it's good to see some countries like Germany taking the issue of cloud security seriously, there is a worrying attitude emerging elsewhere," said Jason Hart, CTO, Data Protection at Gemalto. "This may be down to nearly half believing the cloud makes it more difficult to protect data, when the opposite is true." "The benefit of the cloud is its convenience, scalability and cost control in offering options to businesses that they would not be able to access or afford on their own, particularly when it comes to security. However, while securing data is easier, there should never be an assumption that cloud adoption means information is automatically secure. Just look at the recent Accenture and Uber breaches as examples of data in the cloud that has been left exposed. No matter where data is, the appropriate controls like encryption and tokenization need to be placed at the source of the data. Once these are in place, any issues of compliance should be resolved."
Maxim, NVIDIA Partners for Autonomous Driving and Safety Applications
Maxim Integrated Products, NVIDIA announces partnership to support the industry’s first Level 5 full-autonomy system, the NVIDIA DRIVE Pegasus platform, as well as NVIDIA DRIVE Xavier for Level 4 driving. Maxim’s Automotive Safety Integrity Level (ASIL) solutions and high-performance analog integration, which include next-generation gigabit multimedia serial link (GMSL) serializer and deserializer (SerDes) technology, as well as a power system monitoring solution, provide the flexible foundation necessary to meet functional safety requirements for NVIDIA’s autonomous driving platform. To address consumer concerns about driver safety in autonomous vehicles, automakers have increased their focus on safety requirements for ADAS applications. Safety-critical systems, which require redundancy and fault diagnostics, have stringent ASIL requirements. These ADAS systems need interconnect technology that enables the data rich environment for the car of the future. Maxim’s ASIL rated voltage/power monitoring and SerDes technology will be used by NVIDIA to achieve the industry’s first Level 5 autonomous driving system needed to make self-driving cars a reality. Maxim’s next-generation 6Gbps GMSL SerDes technology supports the high data rate, complex interconnect, and data integrity requirements of future automotive infotainment, ADAS, and autonomous driving. This technology also provides the safety relevant features and flexibility needed to build autonomous driving systems such as the DRIVE Pegasus and DRIVE Xavier platforms. As part of the high-performance analog integrations, Maxim also supplies low IQ automotive-grade power management solutions. “Maxim’s new generation of GMSL SerDes technology, analog integration capability, and strong commitment to the automotive market is the right combination to drive NVIDIA’s supercomputer platform to the finish line,” said Randall Wollschlager, Vice President of Automotive at Maxim Integrated.
ST Enables Neonode Add Touch Interaction to Any Object, Surface, or Space STMicroelectronics announces that its state-of-the-art silicon chip enable zForce AIR touch-sensing modules from Neonode, the optical sensor technology company. Neonode’s compact, low-power, and easy-to-use modules add touch interaction to any USB- or I2C-connected object and work with any type of display or surface, including steel, wood, plastic, glass, skin, or even nothing, able to detect touch interactions in mid-air. The innovative approach uses laser-generated infrared light to track touch or gesture control, combining millimeter precision with ultra-fast response. The nonvisible-spectrum light doesn’t impact display quality, add glare, or shift colors. The new Neonode family of touch-sensors uses: • A programmable mixed-signal custom System-on-Chip (SoC) and an STM32 Arm Cortex microcontroller from ST for scanning laser diodes and IR beams to determine the exact position and movements of fingers, hands, or other reflective objects in the light path. • Multiple objects can be tracked simultaneously and interpreted as touches or gestures with extreme accuracy: the coordinates are relayed up to 500 times per second with virtually zero delay. “ST’s leading-edge chip-design capabilities and manufacturing processes have enabled us to build an innovative, high-performance optical-sensor system that is highly complex yet cost-competitive,” said Andreas Bunge, CEO of Neonode. “The advanced mixed-signal SoC and STM32 microcontroller at the heart of our new zForce AIR modules deliver the right combination of touch-control precision in real-time, low power consumption, and configurability.” “This innovative sensing technology can make any object, surface, or space touch- interactive, bringing complete freedom of design,” said Iain Currie, Vice President North Europe Sales, STMicroelectronics. “Neonode’s decision to use ST technologies confirms our enabling role in the development of advanced applications that break new ground in man-machine interaction.” Now available for immediate shipment worldwide through Digi-Key Electronics, the zForce AIR Touch Sensor modules will be displayed on ST’s stand at Embedded World 2018 (February 27 – March 1, Nuremberg).
2017 Acquisition Review Who Shopped Whom and Why? THE TECH INDUSTRY WAS ALL OVER MAKING HEADLINE FOR ITS BILLIONDOLLAR ACQUISITIONS. IN A BEGUILE TO ADDRESS THE DIGITAL TRANSFORMATION, COMPANIES LIKE APPLE AND GOOGLE OR INTEL AND ATOS ALL TRIED THEIR HANDS IN THE ACQUISITION MARKET.
As latest technologies bring new scopes for digital-driven world, it also shot the emergence of integrating new technologies to derive the proven-future of digitalization. In 2017, tech companies aimed at tapping the spree of innovations, wherefore, the tech giants had to equally equate smart investments on acquisitions. As we commence new innovations and technologies in 2018, let’s have a trivial look into the major tech merger and acquisitions of 2017. 1. Intel Acquires Mobileye Intel said in August that it had completed its tender offer for the outstanding shares of Mobileye, a company that develops sensors and cameras for Advanced Driver Assisted Systems (ADAS); the Israel-based company is also known for its computer vision and machine learning technology. The $15.3 billion deal gives Intel a huge advantage in the growing self-driving car industry, a market they estimate will grow to $70 billion annually by 2030. 2. Atos To Buy Gemalto In late November, Atos announced that it has made a formal proposal to acquire Gemalto by way of a public offer for all of Gemalto issued and outstanding shares. Strategically, the combination of Atos and Gemalto will lead to enhanced global leadership in cybersecurity and digital technologies and services, with highly complementary
offerings, technologies, and commercial footprint in the global market. “Atos has been following closely, and with a lot of interest, the evolution of Gemalto as a leading player in digital cybersecurity, IoT and payment and has long admired its global presence and strong customer and technology portfolios. We believe that a combination of Atos and Gemalto would result in enhanced global leadership in cybersecurity, digital technologies and services and in the strengthening of our positioning as a leading payment services provider” said Thierry Breton, Chairman and CEO of Atos. 3. Verizon completes Yahoo acquisition In June, Verizon announced that it had completed its acquisition of Yahoo for $4.5 billion. The US-based telecom company said that it plans to combine its new assets with its existing AOL business to create a subsidiary called Oath, covering some 50 media brands and more than 1 billion people across the world. Tim Armstrong, former CEO of AOL, is heading up these new operations with Marissa Mayer resigned from Yahoo. The deal dated back to February 2016, when Yahoo revealed that it was looking for “strategic alternatives” for its core business, and by July Yahoo had agreed to sell the company’s core internet operations to Verizon. This acquisition spilled over into 2017, with Yahoo’s multiple data breaches
making beadlines. 4. Capgemini Makes Two New Acquisitions Capgemini announces two parallel acquisitions to tap the design and strategy and financial service portfolio. First up is Idean, which is a fast-growing digital strategy and experience design consultancy, headquartered in Palo Alto. The other is TCube Solutions, an Insurance IT services firm, an independent service provider specializing in Duck Creek Technologies. 5. Iron Mountain Buys OEC Records Management Iron Mountain Incorporated announces acquisition of OEC Records Management, providers of records management, imaging services and offsite storage of media, expanding its presence and strengthening the company’s leadership position in India. The acquisition is known to add 16 facilities across 10 locations, and a storage volume of 4 million cubic feet. 6. Genpact Acquires Digital Customer Experience Consulting Firm TandemSeven Genp act announc e d a c q u i s i ti o n o f TandemSeven under undisclosed terms. TandemSeven’s ability to design better customer experiences complements Genpact’s digital capability aimed at transforming business processes endto-end. The acquisition of TandemSeven sought to extend Genpact’s ability to help its clients provide a seamless experience from the front office all the way to the back office. TandemSeven will boost Genpact’s design thinking capabilities that have already transformed operations and end-to-end customer journeys for a number of its clients. 7. Cisco Acquires BroadSoft
In a move that will grow its software footprint, Cisco CSCO paid nearly $2 billion for BroadSoft BSFT , a company that sells cloudbased call control software, a product that is often re-labeled and sold by traditional telephone companies to their customers. This acquisition is what IT vendors dub "the future of work," as it uses technology meant to make it easier for workgroups to communicate with each other. 8. Google Acquires HTC In September, tech giant Google said it has signed an agreement with HTC to buy part of the Taiwanese company’s smartphone business for USD 1.1 billion to boost the search giant’s relatively new hardware business. Google is roping in HTC’s employees including teams that have worked on the Pixel smartphones. The agreement paves for a non-licencing agreement for HTC intellectual property, the companies said in a statement. With this, Google gains firmer grounds over the production of its Pixel smartphones and other devices, which will help bolster sales. 9. Accenture, DayNine Acquisition Deal Accenture announces to have entered into an agreement to acquire DayNine, an affluent global Workday consulting and deployment services provider with vast expertise in helping organizations transform their employee experience and financial management systems to better navigate change and drive growth. Under undisclosed transaction details, the acquisition is sought to foster Accenture’s already strong position in Workday and provide new value for clients. 10. Apple acquires Lattice.io As large tech companies gear up to make a stronger push into machine learning and artificial intelligence, Apple has acquired a company to fill out its own capabilities in the area. As a step in this direction, Apple acquired Californian startup Lattice.io in May for between $175-$200 million. The startup provides an AI-enabled engine that can take unstructured ‘dark’ data and turn it into meaningful and structured insights. And while in true Apple fashion, the tech giant declined to reveal how it plans to use Lattice, the significant price tag suggests it has big plans for the technology to build out its own machine learning capabilities.
11. Ford Buys Argo AI Ford invested billion-dollars in an autonomous vehicle startup Argo AI. Ford is investing $1 billion during the next five years in Argo AI, combining Ford’s autonomous vehicle development expertise with Argo AI’s robotics experience and startup speed on artificial intelligence software – all to further advance autonomous vehicles. Investment in Argo AI strengthens Ford’s leadership in bringing self-driving vehicles to market in the near term and creates technology that could be licensed to others in the future 12. HPE Buys Nimble Storage In March 2017, HPE agreed to buy hybrid storage provider Nimble Storage for $1.09 billion cash, in an attempt to expand its growing storage business. HPE CEO Meg Whitman has been focusing on networking, storage and technology services as part of a major restructuring of the business. Nimble’s predictive flash offerings for the entry to midrange segments are complementary to HPE’s scalable midrange to high-end 3PAR solutions and affordable MSA products. This deal will enable HPE to deliver a full range of superior flash storage solutions for customers across every segment. In addition, HPE plans to incorporate Nimble’s InfoSight Predictive Analytics platform across its storage portfolio, which will enable a stronger, simplified support experience for HPE customers. 13. Google acquired Kaggle Google acquired Kaggle, an online community of data scientists in March this year. Kaggle is known for hosting data science and machine learning competitions as well. Google is claimed to have acquired Kaggle in an attempt to enhance the AI and machine learning functionalities and to take advantage of the 600,000 data scientists at Kaggle's community. 14. CA Technologies acquire Veracode CA Technologies agreed to acquire Veracode, a security testing firm for a deal of $614 million. This deal is meant to expand the development and testing offered for the enterprises and app developers. Veracode offers a software-as-a-service platform and helps developers enhance the security of their apps.
DESIGN, DEVELOPMENT, AND EVALUATION OF A SYSTEM TO OBTAIN ELECTRODERMAL ACTIVITY
Abstract In recent years, activity trackers and other wearable electronic devices have gained popularity due to users’ desire to monitor, measure, and track using various real-time features related to their fitness or health, including the number of steps they take, their heart rate, their heart rate variability (HRV), the users’ temperature, their activity and/or stress levels, etc. One known technique for determining stress levels involves monitoring, measuring, and/or tracking electrodermal activity (EDA), which can be performed by measuring skin impedance or skin conductance. It has been shown in studies that in response to an environmental, a psychological, and/or a physiological arousal, users’ skin conductance would increase. By measuring changes in the skin impedance or the skin conductance over time, metrics can be obtained relating to users’ activity level, stress level, pain level, and/or other factor(s) associated with users’ present psychological and/or physiological condition, allowing users or physicians to take appropriate steps to address their condition based on the obtained metrics. The final goal of this article is to provide a useful physical system to investigate and finally estimate/quantify the stress level of a person. Introduction Stress is a physical, a mental, or an emotional factor that causes bodily or mental tension. Stresses can be external (environmental, psychological, or from social situations) or internal (illness or caused by a medical procedure). Stress can initiate the fightor-flight response, a complex reaction of neurologic and endocrinologic systems. The fight-or-flight response (also called the fight, flight, freeze, or fawn response in posttraumatic stress disorder, hyperarousal, or the acute stress response) is a physiological reaction that occurs in response to a perceived harmful event, attack, or threat to survival. The reaction begins in the amygdala, which triggers a neural response in the hypothalamus. The initial reaction is followed by activation of the pituitary gland and
secretion of the ACTH hormone. The adrenal gland is activated almost simultaneously and releases the epinephrine hormone. The release of chemical messengers results in the production of the cortisol hormone, which increases blood pressure and blood sugar, and suppresses the immune system. The initial response and subsequent reactions are triggered in an effort to boost energy. This boost of energy is activated by epinephrine binding to liver cells and the subsequent production of glucose. Additionally, the circulation of cortisol functions to turn fatty acids into available energy, which prepares muscles throughout the body to respond. Catecholamine hormones, such as adrenaline (epinephrine) or noradrenaline (norepinephrine), facilitate immediate physical reactions associated with a preparation for violent muscular action.
However, under constant demand, the stress system becomes chronically active and can have damaging effects on the health of an individual. There are many kinds of illnesses caused by stress that affect both the body and the mind.1 These will be mentioned later in the article. Methods There are different methods to detect and determine the stress level. The most important methods are: measuring cortisol level, obtaining heart rate variability, or obtaining the electrodermal activity. Measuring Cortisol Level Cortisol is a steroid hormone in the glucocorticoid class of hormones and is produced in humans by the adrenal cortex, within the adrenal gland. It is released in response to stress. Thus, measuring the
cortisol level is considered the gold standard method to quantify the stress level.2 However, this technique has two important issues. One of the issues is the delay between the threat and the variation in the cortisol level, which may be up to 15 minutes. The second and most important issue is that stress levels should be obtained continuously in order to detect the threats and stress situations in the userâ€™s daily life. Thus, this method is too complex, expensive, and unfriendly for anybody and, therefore, cortisol measurement is not a suitable method for general use. Obtaining HRV HRV is the physiological phenomenon of variation in the time interval between heartbeats. It is measured by the variation in the beat-to-beat interval. 3 2 Design, Development, and Evaluation of a System to Obtain Electrodermal Activity
Currently, there are many devices on the market that can measure heart rate. The resolution of these devices is one beat per minute (bpm) in the best case. This resolution is good enough in many applications. However, the required resolution of HRV for stress assessment is 10 or 100 times higher. This means that the sampling frequency and algorithm complexity must be greater and, hence, the power consumption of the system can became too much for a wearable product or a 24/7 application. Obtaining EDA EDA is an indirect measure of neurally mediated effects on sweat glandsâ€™ permeability, observed as changes in the resistance of the skin to a small electrical current or as differences in the electrical potential between different parts of the skin.4 EDA presents more advantages than the other
techniques in terms of power consumption, ergonomics, and circuit size. System Description The objective of this research is to develop a useful tool to investigate and estimate the stress level of a person. The stress level of a person is not constant and it depends on the threats perceived by the person. Those threats are perceived differently by each person and there are many factors that can make a simple event for a person an enormous threat for another. It is not useful to carry out a stress test in a hospital in order to determine the stress level of a person, since these threats appear in the normal life of the patient. Therefore, it is necessary to develop a system that allows us to estimate the stress level of a person during his or her normal life. Thus, this system must be noninvasive, user-friendly, and wearable.
Finally, it must be able to work for several days without being recharged or replaced. The requirements for the final device imply the system must be: »» Battery operated, since it must be wearable »» Low power, since the patient must be monitored for several days »» Reduced size, since it must be wearable and user-friendly »» Low cost, since if it is too expensive, the solution will not be implemented in any consumer device »» Compliant with safety regulations In order to ensure the system is nonintrusive, the recording site must be taken into account. The best placement for the electrodes is the top of the wrist, since this results in the device being: noninvasive, userfriendly, and simple from the mechanical point of view. However, the quality of the signal is not as good as the EDA signal obtained from other body locations, such as the medial phalanx in the index and middle fingers.5 Once the electrodes’ placement to obtain the EDA signal is decided, it becomes obvious that the final (target) system will present the form of a smartwatch or a similar device. At this point, the next specification to determine is the area that can be used by the EDA circuit. Several smartwatches were analyzed and various vendors were consulted about this topic in order to determine this parameter. The conclusion was the maximum area of the EDA circuit should be less than 5 mm × 5 mm. The power consumption of the EDA circuit is the third parameter to set. This parameter is key to ensure the system will be able to record the EDA signal during several days without recharging or replacing the device. The battery’s capacity for different smartwatches and the power budget of some possible commercial systems are obtained. The target for the power consumption obtained after this investigation is fixed at a maximum average consumption of 200 μA. Finally, the last specification to determine is the cost. However, this is not determined at this stage, since there are several factors that can affect the final cost of the device. The circuit topology and components are selected to ensure a reasonable cost for the final solution. Hardware Design This section describes how the circuit topology, range to measure, and resolution are determined. One of the key decisions is to determine the topology of the circuit. Basically, there are two methods to measure an impedance. The system can apply current and measure the voltage across the impedance, or it can apply voltage and measure the current across the impedance. Besides, these signals can be dc or ac.6 It is important to analyze the advantages and disadvantages of each method. There are dozens of circuits that measure ac and each one has its pros and cons. However, in order to accomplish the restrictions in performance, cost, and area, the following solution is considered as the best option. The final decision is to use an ac voltage source as the excitation source and measure the current through the patient’s body to determine the skin conductivity. This solution avoids high voltages
over single sweat glands, eliminating the danger of sweat gland damage and allowing the compliance of the IEC6060-1 standard. The ac signals eliminate the problem of electrode polarization. 7 The current that must be measured needs to be digitalized, stored, and analyzed. It means the circuit will require an analog-to-digital converter (ADC). As most ADCs convert voltage and not current, the current through the patient’s body needs to be translated to voltage. This is carried out by a transimpedance amplifier (TIA). The noise specifications, size, and power consumption are three critical characteristics to choose the best operational amplifier, which will be used to implement the TIA. Once the topology of the system is decided, the next step is to determine the range and resolution of the system under development. Problems for the amplification of the EDA signal mainly stem from its wide range and the required high resolution. Typically, a skin conductance device must cover a range from 0 μS to 100 μS and it must also be able to detect 0.05 μS fluctuations. This resolution can be achieved using an ADC with at least 12-bit resolution. Regarding the resolution, the target in this project is 0.01μS, and, therefore, an ADC with 14-bit or 16-bit resolution is required.8 In order to get a resolution of 0.05 μS within a range of 100 μS while complying safety regulations, these blocks are required. »» An ac voltage source »» Protection elements to ensure compliance with IEC6060-1 »» An electronic circuit to measure the current flowing through the patient’s body Variations in the ambient temperature and skin temperature can produce changes in the EDA signal.9 Thus, it would be interesting to acquire the ambient temperature and skin temperature, too. It can be carried out by a simple thermistor plus several discrete components and an ADC. Finally, power consumption is critical in this circuit. In order to reduce it and ensure the system is only activated when a new measurement is required, a power management unit must be also integrated. This block must be easily controlled by the main microcontroller and it has to supply all the EDA measurement circuit. Figure 1 shows the complete block diagram.
for this application. Power Management Unit The decision is to use the ADP151 family to implement the power management unit due to several good features, and because its package and noise level are excellent for this application.10 Level Shifter There are many ways and a broad range of integrated circuits to implement a level shifter. However, the area and price of those integrated circuits do not accomplish the restrictions of this project. Thus, the level shifter in this circuit was implemented by discrete components. Basically, it is formed by a transistor, DMN2990UFZ,11 and a resistor. Low-Pass Filter and TIA In order to implement the low-pass filter and the TIA, the ADA45052ACBZ is used as it has excellent power consumption, small size, and very low input bias current.12 ADC The ADC that accomplishes all the system requirements is the AD7689BCBZ. This powerful ADC includes the voltage reference that can be turned off when it is not used in order to reduce the power consumption.13 Finally, in order to ensure the area constraint can be achieved, the minimum number of components and functionalities have been included and the smallest packages for all the components have been picked. Figure 2 shows the layout and size of this system.
In the following sections we will determine the best components
Software Design As mentioned previously, the system needs to generate an excitation signal in order to measure the conductivity of the skin. This excitation signal is an ac signal, and the two parameters, which can be extracted from an ac measurement, are the amplitude of the signal and the phase delay between the excitation signal and the acquired signal. The most important one is the amplitude, and there are several ways to obtain this parameter from an ac signal. However, the best method to obtain the amplitude in this system is to implement a discrete Fourier transform (DFT). 14 The DFT can also be considered like a bank of filters and the level of attenuation is directly proportional to the number of samples, and the position of the maxima depends on the excitation signal. At this point, a good argument would be to use a big number of samples ( N) to implement the DFT since it would improve the SNR. However, the power consumption of the DFT (if implemented directly) is proportional to the number of samples and we will need more power as we acquire more samples. This means that there is an important trade-off between the number of samples and the power consumption. Another important parameter is the ratio between the sampling frequency and the excitation frequency. The equation that implements the DFT is very simple if the sampling frequency is 4× the excitation frequency. In this case, the complex equation involving floatingpoint multiplications turns into additions. Multiplications can be bearable if the available processor is a DSP or a Cortex®-M4. However, this can be an important problem when the calculation must be implemented in a Cortex-M0. Compare Equation 1 to the filter notation of a single-point DFT calculation for a 100 Hz bin (FCENTER) when the sampling frequency (FS) is 400 Hz and 500 Hz.
Once the technique to apply and the ratio between the excitation frequency and the sampling frequency are clear, the next step is to determine the excitation frequency. The excitation frequency must be as low as possible to ensure the current will flow through the patient’s skin and it will not penetrate into the body.15 Therefore, the excitation frequency must be smaller than 1 kHz. It must also be mentioned that the main source of noise in this application is the 50 Hz/60 Hz noise due to the power mains.
Equation 2 shows that each component of the DFT, X(k), nulls the contribution of the spectral components of the form n × FS/N where n = 0, 1, 2, and through N – 1, except for when N = k. By properly defining the excitation frequency we may cancel the contribution from the 50 Hz noise source. However, a high frequency cannot be used due to the previous arguments. Thus, a good trade-off is 100 Hz, although we may capture the harmonics of the main’s interferer. If the excitation signal is 100 Hz and the sampling frequency is 400 Hz, the zero at 50 Hz appears when N is equal to 8, 16, and 32. We must also keep in mind the number of samples must be as small as possible to minimize power. Thus, a good trade-off is to use 16 samples to implement the DFT. The number of samples can be increased in order to improve the SNR if it is required. Of course, if the noise is the 60 Hz noise instead of the 50 Hz, the sampling frequency should be 480 Hz and the excitation frequency should be 120 Hz. The frequency response is shown in Figure 3 and the mathematical equation, which only involves addition, is shown in Equation 3.
Mechanical Design An evaluation system was developed to test and prove this proposed solution. The platform is composed of the main sensors required in EDA measurements and some other indispensable features. Movement and temperature may affect the skin impedance measurement.9, 16 Therefore, signals capturing motion and temperature are also obtained.
The system also includes a battery charger to recharge the LIPO battery used in this platform. This device requires a battery with high capacity, as we want to enable 24 hour acquisitions. Impedance, temperature, and acceleration measurements are saved in a file which is stored in a micro SD card or the data can be sent by Bluetooth ® low energy to a tablet or PC. Figure 4 shows the evaluation platform.
Results SNR Study A mathematical analysis is carried out to ensure the required resolution could be achieved with the noise of the selected components and the bandwidth of the system. However, this feature has to be checked with actual measurements. In order to do it, the prototype system is used to measure several resistor networks to check functionality. The study consists of obtaining several measurements of the same resistor network to check the repeatability and, therefore, obtaining the system’s accuracy. In this test, 100 measurements are performed for each network and the maximum error is obtained by subtracting the minimum value to the maximum value of the obtained results. The error is always equal to or smaller than 0.01 μS. Once the accuracy of the system is validated, the next step is to check the system’s linearity. In order to carry out this experiment, the prototype is connected to a programmable resistance substituter and the range from 10 kΩ to 500 kΩ in steps of 1 kΩ is evaluated. The R2 of the system is 0.9999992. Power Consumption Study The EDA system is formed by a state machine with different statuses in order to obtain the patient’s skin conductivity and ensure the minimum power consumption. Initially, in status one (S1), the EDA’s AFE is turned off and just the microcontroller and the accelerometer are on. The average current consumption is 139 μA. After approximately 150 ms, the EDA AFE is turned on, the square signal is generated by the MCU, and filtered by the LPF. The ADC reference is turned off during this stage (S2) because the signal is not stable yet. Six cycles are required to ensure the signal is stable and, in the worst case, the average current consumption in S2 is 230 μA. The ADC reference is turned on in the S3 and the system
Experimental Tests At this point, the system has been electronically evaluated—hence, the next step is to correlate the EDA circuit with a reference. In this case, the E4 platform from Empatica is used as the reference due to its good performance. Once the reference is decided, we decide the test that must be carried out to see a variation in the EDA signal. The selected test was the relaxationstress test. This test is formed by two steps: the first step is a relaxation exercise and the second step is a stress exercise. The relaxation exercise consists of 10 minutes of paced breathing to reach a relaxed state. The stress state is achieved by playing the colorword-sound game. In this application, the user listens to a color and sees the text of a color, which is illustrated with a color. Either the audible color, the texted color, or the illustrated color can be the same or different. As the reader can observe in Figure 6, there is a sentence that can be: »» Choose color »» Choose sound »» Choose word Depending on the message of the sentence and the audible, text, or color, the person under test will have to press the correct button. The user must respond before the progress bar finishes. If the user does not respond in that time, or if the response is wrong, the score value will be decremented. If correct, the value will be incremented. Finally, the buttons’ positions are swapped. There are several settings that can be modified in this application to modify the level of the experiment (level of stress).
waits for 10 ms to ensure the reference is stable—the average current consumption in this stage is 730 μA. The system acquires four samples during four cycles in order to obtain 16 samples to implement the DFT in S4. The power consumption in this stage is 880 μA. The DFT is implemented in stage S5. The accelerometer data is also obtained in this status, and the current consumption in this stage is around 8 mA. Figure 5 shows the power consumption of the system. This study proves the average power consumption of the EDA AFE requires less than 170 μA.
Theoretically, the skin conductance should decrease during the relaxation task and it should increase during the stressful activity. Peaks or spikes should be observed during the stressful activity. The variation in the dc level corresponds to the tonic response to the stressor. The observed peaks in the stressful activity are considered the phasic response, which does not appear during the relaxation task. Once the procedure to obtain a clear variation in the EDA signal and the expected response have been exposed, the next step is to carry out an experiment to compare the performance between our EDA solution and the Empatica E4 platform. In order to compare them, both devices are worn simultaneously while the person is doing the test. The Empatica solution is worn on the right hand and the system under test is worn on the left hand. This means the expected signal must be similar but not exactly the same, since each device was worn on different arms and the measurement location is not exactly the same, because the Empatica obtains the EDA signal from the bottom of the wrist while our solution obtains the EDA signal from the top of the wrist. The obtained signals by both devices are very similar as shown in Figure 7. This experiment was repeated several times with different patients in order to validate to validate the system.
Conclusion This EDA circuit is a smart solution to obtain skin’s conductivity. Its average current consumption and size ensure its integration in any smartwatch or similar platform. The device achieved the expected performance as it measures the skin’s conductivity in a wide range with a high resolution. The EDA circuit design ensures its compatibility with any kind of electrodes, since the polarization and half-cell potential effects are avoided. Besides, the IEC6060-1 requirements are fulfilled. In order to evaluate and test the features of the circuit, a prototype was designed. The system was designed to obtain the EDA signal, in combination with the skin temperature, ambient temperature, and motion, during 24 hour sessions with no recharge, and to store the information or transmit it wirelessly in real time. Therefore, this platform can be used to collect EDA data from different people in different situations in any moment of their lives. Finally, this information can be used to develop algorithms that can detect, estimate, or predict the stress level of a person.
Melissa Conrad Stöppler. “Stress.” MedicineNet.com, 2016. Danmin Miao, Li Luo, Lijun Xioa, and Xiaomin Luo. “The Relationship Between Mental Stress Induced Changes in Cortisol Levels and Vascular Responses Quantified by Waveform Analysis: Investigating StressDependendent Indices of Vascular Changes.” Biomedical Engineering and Biotechnology, July, 2012. 3 Chu Kiong Loo, Einly Lim, Manjeevan Seera, Naoyuki Kubota, and Wei Shiung Liew. “Classifying Stress From Heart Rate Variability Using Salivary Biomarkers as Reference.” IEEE Transactions on Neural Networks and Learning Systems, October, 2016. 4 Wolfram Boucsein. “Principles of Electrodermal Phenomena.” Electrodermal Activity, pp 1-86, Springer U.S., 2012. 5 Wolfram Boucsein. “Recording Sites.” Electrodermal Activity, pp 104-109, Springer U.S., 2012. 6 Wolfram Bouscein. “Introduction to Electrodermal Measurement” Electrodermal Activity, pp 88-103, Springer U.S., 2012. 7 Banu Onaral, Herman P. Schwan, Banu Onaral. “Electrical Properties of Bioelectrodes.” IEEE Transactions on Biomedical Engineering, December,1984. 8 Wolfram Boucsein. “Specific Problems of Electrodermal Measurement.” Electrodermal Activity, pp 96-98, Springer U.S., 2012. 9 Wolfram Boucsein. “Climatic Conditions.” Electrodermal Activity, pp 189-192, Springer U.S., 2012. 10 ADP151 Data Sheet. Analog Devices Inc., 2017. 11 DMN2990UFZ Data Sheet. Diodes, 2015. 12 ADA4505-2 Data Sheet. Analog Devices Inc., 2017. 13 AD7689 Data Sheet. Analog Devices Inc., 2017. 14 Julius O. Smith III. “Mathematics of the Discrete Fourier Transform (DFT): with Audio Applications.” Stanford University, 2002. 15 Wolfram Boucsein. “Exosomatic Recording with Alternating Current.” Electrodermal Activity, pp 126-129, Springer U.S., 2012. 16 Wolfram Boucsein. “Physiologically Based Artifacts.” Electrodermal Activity, pp 141-143, Springer U.S., 2012. 1 2
About the Authors
Javier Calpe [email@example.com] received his B.Sc. in 1989 and his Ph.D. in physics in 1993, both from the Universitat de Valencia, Spain. Javier is the site manager of ADI’s development center in Valencia, Spain. Jose Carlos Conchell [jose.conchell@ analog.com] is a product applications engineer in the Industrial and Healthcare Business Group, based in Valencia, Spain. He focuses on bioimpedance applications. José Carlos Conchell joined ADI in 2011. He received his B.Sc. and M.Sc. degree in electrical engineering and M.Sc. degree in biomedical engineering from Universitat de Valencia, Spain, in 2007 , 2010, and 2016 respectively.
Full SiC Power Modules from ROHM Revs-Up Formula E racing Team Venturi Enhancing performance through significant reduction of size and weight ROHM has announced to provide the full SiC power modules to the VENTURI Formula E team in the FIA Formula E 2017–2018 (season four), the leading racing event for electric vehicles which will start on December 2nd and 3rd in Hong Kong. This module will support further improvements in the machine’s performance under racing conditions. As the leading developer of SiC power devices, ROHM became VENTURI’s official technology partner in season 3, and provides the world’s most advanced SiC power devices used in the inverter, which is the core of the electric vehicle powertrain. The inverter for season four features embedded full SiC Power module, making it 43% smaller and 6 kg lighter than the inverter for season two. ROHM will continue making technological advancement in power devices, contributing to the development of society. Inverter Comparison Formula E is an all-electric-powered FIA (Fédération Internationale de l'Automobile) championship that began in 2014. The series has expanded to cities around the world which has to date included metropolises
such as Hong Kong, Berlin or New York and champions a clean environmental approach that does not use fossil fuels. The key to victory in this racing series for the drivers is to use power as efficiently as possible by getting the most performance out of the stored energy. The advancement in Formula E technology is expected to filter through developments to general-use electric vehicles. Although this motorsports event is still in its infancy, it already enjoys the participation of automotive manufacturers from around the world and major automobile manufacturers including those from Japan have declared their intention to join the race.
For many years, ROHM has provided a highly varied lineup of products such as power supply ICs and various control ICs, along with discrete products such as power devices, current detection shunt resistors and so on for use in automobiles. ROHM is pushing forward with the latest cuttingedge development of SiC power devices, which are expected to realize dramatic loss reductions compared to conventional Si (silicon) power devices. These power devices will be used more and more on electric vehicle (EV) motors and inverters. Franck Baldet, CTO, VENTURI Formula E Team, said, “The Formula E is the only
EV Kazuhide Ino, Group General Manager of Power Device Production Headquarters, ROHM Co., Ltd., said, “ROHM has been providing products for many years for today’s constantly evolving automobiles, with quality as our main advantage. This is currently a field in which we would like to give our special attention; and semiconductor devices are certain to play a crucial role in recent hybrid and electric automobiles. The SiC power device that we are providing for the Formula E racing car is one example. We provided SiC-SBDs in season 3 last year (2016–2017), but this year we provide full SiC power modules that combine SiC SBD and SiC MOSFET. These modules will contribute to improve vehicle performance. I hope that we can continue to contribute to society through the efficient conversion of energy in a wide range of industries and fields, starting with electric vehicles.”
motorsports event for testing the latest technology in next-generation electric vehicles. We are extremely happy about our technical partnership with ROHM in the area of power management, which is the foremost key to the Formula E race. For season 4, by adopting a full SiC power module, we were able to bring to reality a lightweight inverter that requires only a minimum amount of space. By using the latest technology, I expect that we will be able to dramatically reduce our lap times, and I hope that we can continue to move forward with revolutions in technology through our partnership with ROHM.”
The Advantage by Using SiC Products The SiC power module used in the inverter of the VENTURI Formula E team racing car achieves a large power throughput, owing to the development of a new package with an improved internal module structure, as well as an optimized thermal management. Compared to conventional IGBT modules with similar current ratings, this module reduces switching losses by 75% (at a chip temperature of 150°C). This contributes to the energy efficiency for the whole application. Also, having more compact peripheral components throughout the high-frequency drive, as well as the effect of reductions
in switching losses contributes to a more compact cooling system as well. By using this full SiC power module in the inverter section (the powertrain core), it makes the inverter 43% smaller and 6kg lighter than in season two. Even compared to the previous inverter used in season three, it is 30% smaller and 4kg lighter.
With the fast evolution of technology and its innovative implantation to drive business intelligence, it is imperative to understand the key developments in the area. CRM or Customer Relationship Management has seen a marked growth in 2017, recording widespread acceptance and adding several innovations to its structure. Being perceived now as an essential standard business procedure, CRM in 2018 can get a grand transformation. Listed here are some of the key trends to look out for: Accessibility For a successful cashless economy, financial inclusion is imperative. The Pradhan Mantri Jan Dhan Yojana is one such successful step which has created 18.15 crore bank accounts in rural/semi-urban areas and 12.7 crore in urban geographies, adding 23.27 crore RuPay debit cards to the cashless ecosystem. Further, UPI and Bharat QR scan & pay instruments have simplified cashless transactions and made it accessible for the rural and marginalized income groups with lower literacy rates.
While these are encouraging initiatives, there still remains a large divide in the cashless instruments and the available infrastructure to use them. For e.g. there are currently over 830 million debit card users in the country with only 2.9 million POS terminals, where these can be swiped. Similarly, while UPI and QR code operated asset light instruments is expected to reach 1.5 million users by March 2018, there are currently only 7 lakh shops or POS terminals where these can be accepted.Matching the rise in digital payments instruments with accessible payment infrastructure is a vital
challenge that needs immediate attention. Digital Literacy With the second largest population of internet users in the world, India is an active digital player when it comes to entertainment, social networking, communication, online shopping etc. However, the use of internet as a significant medium for cashless transactions is yet to be actively realized. As per a recent report, it is estimated that out of the 460 million mobile only internet users in the country, only 125 million are fluent in English â€“ the language largely used for instructions in
of digital payment instruments, from UPI BHIM, BharatQR and Aadhaar enables payments are all positive policy initiatives that are driving digitalization amongst diverse strata of the society. However, policy interventions that incentivize digitization at the grass root level are vital for successful implementation of the cashless economy. These include: - Tax incentives to payer and receiver for using cashless payments - Discounted/ incentivized MDR rates - Shift to digital documentation of banking transactions, KYC and other financial services records Infrastructure Limited access to high speed data networks, unreliable and weak connectivity, proliferation of sub-standard hardware like counterfeit mobile phones and pirated software are some of the challenges plaguing digital infrastructure in India. In line with the ambitious Digital India initiative, a large-scale development of infrastructure is underway and is set to adequately address these issues. The key pillars for the digital transformation, set to accelerate Indiaâ€™s global standing as a cashless economy, include: - Broadband Highways - Public Internet access programs
majority of digital transaction platforms. Apart from the language, a most of rural and low-income group population find the available digital platforms either too complicated or simply not compatible for their current expenditure patterns. While government partnerships with international leaders like Google for essential skill training, proliferation of Indic language on the web and digital infrastructure development for public environments are all steps in the right direction, a comprehensive digital literacy campaign among defined target groups like women, youth, micro merchants and illiterate group is vital for a successful cashless economy. Financial Policy structure Thoughtful policy decisions taking into account interest of consumers and all stakeholders in a payments transaction will be instrumental in driving the cashless economy. Demonetization, strategic Digital India campaign, reduction of MDR and subsidy on debit card, UPI BHIM and Aadhaar enabled transaction below INR 2000will push the cashless economy cause further. The implementation of Goods & Services Tax was yet another factor that encouraged transparent taxation and cashless transactions to create an organized marketplace. Additionally, with a variety
- Universal access to mobile connectivity - Electronic delivery of services - E-governance Reconstructing Mind-sets India has always been a cash friendly country and major digitization is largely driven by millennial and globe-trotting urban population. The average Indian continues to remains speculative about usingthe digital platform, when it comes to his money. Demonetization was an effective wake-up call that helped break the heavy cash dependent mindset, albeit temporarily. A strong campaign directed to address the strong pro-cash mind-set is vital to drive digitization. These efforts need to address: - Lack of trust in the digital framework - Extensive dependence on hard cash and hard copy documents - Peer pressure Conclusion: Factors listed above offer a sneak peek into current status of digital transactions in India, chronicling the challenges, government efforts and shortfalls. It also offers a holistic view of the macro and micro environments and the possible multi-pronged, customized and agile solutions to drive digitization.
COVERAGE Announcements Tells Why
Semiconductor Giants Are Global Bigwigs The biggest stage for consumer electronics is set at CES 2018, but the proven theory of product based smart electronics is stipulated by semiconductor giants. The semiconductor heavyweights are slating their excellence of innovations and logging the future of electronics. CES -2018 is prudently cementing the virtual future of innovations and technology to reality. Visitors today are not just peppy about smart consumer electronics but the enablers of these smart technologies. From automotive to smartphones, semiconductor companies like Infineon, STMicroelectronics, Microchip, Texas Instruments, Renesas, Maxim and ON Semiconductors have elevated the innovative decorum of the show. With the growing interest of core electronics among visitors, the semiconductor giants have successfully effectuated to keep the visitors on the edge. This year at CES 2018 (January 9 to January 12 in Las Vegas) semiconductor giants are probably connecting the digital atmosphere as electrified electronics rules the show.
A compilation of innovative solutions duly accolades the semiconductor giants as they keep visitors on fancy: Fueling the future at CES: Infineon D i s r u p t s W i re l e s s C h a rg i n g f o r Automotive and Consumer Applications Infineon Technologies showcased one of its premier flexible chip sets for high performance including software IP for smart and safe wireless charging applications. The Infineon XMC microcontroller provides a powerful and cost-effective platform. The scalable architecture can support everything from a fast charge smartphone, to a 20 W robot, up to a 60 W drone and beyond. Paired with power products, like MOSFETs and Driver ICs, this system can provide full power wireless charging without complicated thermal management, often achieving charging rates equivalent to wired charging. STMicroelectronics Smart Driving and the Internet of Things (IoT) Turned Heads at CES - 2018 ST to show its latest silicon technologies and solutions for the next generation of applications in the broad IoT market and mobility platforms and services. ST is
enabling Smart Driving and applications for the Smart City, Smart Home, Smart Industry, and Smart Things of today and tomorrow. Use cases focus on key consumer and industrial technologies including AR/ VR/MR, Voice Control, Imaging, Artificial Intelligence, Wireless Charging, Solutions for Industrial Condition Monitoring and Predictive Maintenance, Safety, Connected Technologies, and Services for Mobility CES 2018: Qualcomm unveils smart home hub collaboration with Google At CES 2018, Qualcomm and Google announced a new collaboration that aims to put the Google Assistant into more devices around the home. The collaboration includes two Qualcomm Home Hub platforms based on the SDA624 and SDA212 system on chips that support Google's Android Things. ON Semiconductorâ€™s AR0430 Image Sensor Recognized at CES 2018 ON Semiconductor is driving energy efficient innovations, during the show ON semiconductor announced a new 1/3.2-inch Back Side Illuminated (BSI) 4 Megapixel (MP) CMOS digital image sensor. The AR0430 delivers 120 frames-per-second (fps) performance supporting slow-motion
video in 4 MP mode. CMOS digital image sensor addressing applications including IoT, AR/VR and security cameras is selected as a 2018 CES Innovation Awards Honoree. Intel’s new core processors with AMD graphics The company revealed the eighth generation of core processors that feature discrete graphics from their long-time rival, AMD. This collaboration will make way for incredibly thin and light laptops and PCs that will provide impressive gaming performance and 4K media streaming. NovAtel technology showcased at CES 2018 with Renesas Electronics NovAtel technology with Renesas Electronics Corporation demonstrates high integrity and accurate positioning solutions for autonomous driving, ADAS, connected car feature demonstrations and automotive solutions. NovAtel and Renesas are currently collaborating on implementing NovAtel’s high-performance GNSS+INS positioning solution with the Renesas R-Car H3 system-on-chip (SoC). The R-Car H3 is compliant with the ISO 26262 functional safety standard for automotive applications, which aligns with
NovAtel’s automotive strategy. Texas Instruments Highlighted New Automotive Headlight Technology Sought to be available in second half of 2018, Texas instruments has developed a new technology called DLP for highresolution automotive headlight systems. The solution took the center-stage of this year’s CES-2018. Cypress Semiconductors Automotive Chipset Makes Noise at CES - 2018 Cypress Semiconductor also announced a new WiFi combo chipset targeted at automotive applications. Car connectivity gets increasingly common-place and users enjoy the same media experience they experience at home, and there’s the need for vehicle manufacturers to keep up with the ever-evolving technology landscape such as new WiFi standards. Molex and Microchip Powered Fabricates the Future of Automotive Infotainment Systems Molex and Microchip Technology collaboratively showcased the development of integrated USB Media Modules and USB Power Delivery Solutions for automotive infotainment systems. The Molex CES 2018
booth puts demonstrations of USB Media Modules and Power Delivery Solutions. It also brought Microchip’s USB devices which are optimize USB Power Delivery functionality, reducing overall BOM costs by architecting a total system solution that can be easily designed into a single module. Maxim Integrated ‘Design’ Electronics Innovation at CES 2018 At the Consumer Electronics Show (CES) in Las Vegas, Nevada (January 9-12, 2018), Maxim Integrated Products demonstrated how it is empowering design innovation through its high-performance mixed signal and analog solutions. Maxim will showcase technologies and provide demonstrations within several applications, including – Automotive, Healthcare, Mobility etc. CES is getting bigger and semiconductor giants have evidently shown their strong-arm to embark innovations to foster and feed the future of innovations in the global-ready digital and connected world.
How Advancements in Wireless Communications and 5G/LTE Technologies are Transforming Businesses The transportation industry is facing a future where smart and driverless vehicles will become part of the service ecosystem; vehicle-to-infrastructure communication will become deeply necessary. However, it will need a high-speed, wireless data network to decrease analytical complexities and operational costs. Also, industries relying on vehicle-based services will need to meet consumer needs by undergoing a significant change in data strategies. Additionally, vehicle-to-vehicle/infrastructure communication, in order to reduce accidents and increase efficiency, would need to support high density with very low latency. Vehicle operations are becoming increasingly software driven and automation in interaction with palmtop devices are becoming unavoidable. Proliferation of 5G will be a welcome sign for companies, as consumers already expect their services to be ready in real-time, let alone in the future. Other industries like, the manufacturing sector, which will play a key role in such an environment, IoT serving multiple segments also needs to consider 5G necessary for the near future. Changing times and science Organizations may have 3G/4G
Communication between vehicles, machines, and people Customers are often required to provide data based on their requirements. But enriching the
mobile communication systems, but
data environment means intelligent machine behavior based on context. Exchange of data
to make productive use of assets such
between the consumer's vehicle, or product, and the brand's customer service need not
as vehicles and service offers, 5G
require human participation for the most part in the coming years.
capabilities will be necessary soon. "Fifth generation" wireless systems were thus long expected to become the common driver for business units across multiple sectors. Research on the subject has been on since the early 2000s. Even when 2G and 3G mobile data was perceived nonstandard for enterprises, scientific research was on its way to the "long-term evolution" (LTE). 5G technology brings the kind of speed that is adequate to stay perpetually connected.
In case of a wireless-devices environment, one can receive alerts and notifications on mobile devices about problem resolution. This concept can also extend to OEMs, which can resolve vehicle issues based on end-user experience. This will take into account the automated equipment in plants, which can exchange data with personnel and other machines after taking inputs from the market.
How professional accountability will improve Handling huge volumes of data across consumer devices on a global wireless network is a step forward toward professional accountability. Larger volumes of data imply more accurate understanding of service quality. Technology can also help restrain the complexity of a task from growing with respect to individuals, making accountability more transparent. Industry leaders have always sought to make their workers feel empowered. Now they can reduce complexity by shrinking the workflow to a network of personal devices and companies, and provide vehicle-related services with data that helps respond to market expectations. About Author: Jayasimha has over 24 years of experience in architecting, developing and delivering solutions and products in connectivity areas in the domains of portable devices, consumer electronics, automotive and IoT. Jayasimha is currently working as a Senior Architect in Product Engineering services, keeping track on emergence and advancements of technologies, and supporting solutions in connectivity areas across Sasken.
WHAT 5G MEANS FOR ORG.
Technology transformation required in enterprises A rules-based system to exchange data between personnel, customers, and public vehicles, such as cabs, trains, and buses, can initiate notifications to specific people in the business network. This will have to be conducted through a role-based authentication system, which is already prevalent. However, one must rely on digital networks that support not just multiple types of devices, but a combination of technical and service-related data in larger volumes. The personal-device ecosystem feeds on automation applications at the enterprise end, which needs to harness data efficiently. While individual systems may have the capacity to process data quickly, a 5G network will allow the service units to integrate holistically. Network reliability remains the central factor. That is why advancements in wireless communications and long-term evolution (LTE) technologies have become the focus for businesses and research institutes.
»Seamless » data flow between automation and businesscommunication systems »Workers, » external parties, and customers staying in better sync »Machine-to-machine » communication to reduce workload »Faster » turnaround and higher workflow integrity
We are in the midst of a long-term evolution everywhere What began with GSM/EDGE technologies is headed toward becoming ultra-reliable 5G wireless systems. They are the result of an evolution based on pre-existing technologies (some still in use) coupled with a new applications of radio wave. In 2015, 3GPP played a landmark role approving 4.5G or LTE-Advanced Pro, and it has kept alive the European dream of going 5G by 2020. Essential sectors like hospitality, utilities, transport, and manufacturing will be able to offer a more user-friendly service without anyone in the ecosystem having to rely on complex task administration. Wireless devices themselves will have the power to use networks and exchange data with other wireless devices across service providers.
Heilind Electronics to Now Offer 3M 100 Gbps QSFP28 Copper Cable Assemblies, 9Q Series Heilind Electronics fosters its broad inventory of interconnect and cabling products. Heilind Electronics, the authorized distributor for 3M has recently announced to add manufacturer’s QSFP28 9Q Series direct attach copper cable assemblies. Exclusive at Heilind Electronics, the New 3M QSFP28 direct attach copper cable assemblies, 9Q Series offers: • It is available with custom EEPROM mapping, the QSFP28 cable assemblies deliver speeds of up to 100 Gbps while virtually eliminating high-frequency resonance. • They are also highly flexible and allow for bending with minimal to no impact on performance. • A key feature of the assemblies is the low profile design; this not only enables efficient routing in tight spaces, but also allows the cables to be stacked and bundled in configurations that optimize airflow. Along with their excellent routability and cost-effectiveness, the QSFP28 cable assemblies are RoHS-compliant and follow standard industry protocols. This makes them a popular choice when connecting switches and servers in high-speed equipment.
Vicor’s Power-on-Package Solution Bags Product of the Year Award Vicor Corporation announces that it was honored with an Electronic Products’ Product of the Year Award for its Power-on-Package modular current multipliers (MCM) for high-performance, high-current, CPU/ GPU/ASIC (“XPU”) processors. Vicor’s was one of only 12 products to be selected in Electronic Products’ designated award categories. The winning products were selected on the basis of innovative design, significant advancement in technology or application, and substantial achievement in price and performance. Vicor’s Power-on-Package solution demonstrated breakthrough performance among power products by freeing up XPU socket pins and eliminating interconnect losses from the motherboard to the XPU, enabling higher current delivery for maximum XPU performance. “Power-on-Package enables XPUs to achieve previously unattainable performance levels which are required for demanding applications such as Artificial Intelligence”, said Robert Gendron, Corporate VP of Product Marketing at Vicor. “MCMs deliver higher peak and average currents to XPUs by eliminating traditional motherboard and socket power delivery limitations.” 2017 marks the 42nd annual Electronic Products’ “Product of the Year Awards,” recognizing the best products in the industry. The 2017 Product of the Year Awards were announced in the January 2018 issue of Electronic Products with a cover feature and a brief description of each product.
Texas Instruments (TI) announces to strengthen its C2000 Piccolo microcontroller (MCU) portfolio. TI has added the new C2000
TI Strengthens its C2000 Piccolo MCU Portfolio for Extended Efficiency in Power-Control Applications F28004x MCU family – optimized for powercontrol in cost-sensitive applications such as on-board chargers for electric vehicles (EVs), inverters for motor control, and industrial power supplies. By adding this new family of real-time control devices that integrate a floating-point unit, math accelerators and an optional parallel processor, TI claims C2000 Piccolo MCU portfolio continues to set industry standards by boosting the performance of its 100-MHz central processing unit (CPU). Key Features and Benefits of the New C2000 F28004x MCUs
• Streamlined performance and power: With 60 percent lower active power than previous Piccolo devices; the optional on-chip DC/ DC converter reduces active power up to 70 percent. • Advanced actuation and design flexibility: Fourth generation of TI’s high-resolution pulse-width modulation (PWM) timer technology implements the most advanced high-frequency switching techniques for increased efficiency and power density. • Enhanced digital and analog crossbars: Combining inputs, outputs and internal resources enables flexibility to support control and protection mechanisms. • New capabilities: Embedded real-time analysis and diagnostic unit enables enhanced debugging, an ultra-high-speed serial interface improves throughput over isolation boundaries, and flexible boot modes give developers the ability to reduce or eliminate boot mode pins. Developers can reduce bill-of-material (BOM) costs while building smaller, more reliable systems by taking advantage of the industryleading integrated analog of the C2000 Piccolo F28004x MCUs, which offer system protection and new capabilities to enable development of high-performance power-control systems. The integrated analog features include three independent 12-bit analog-to-digital converters (ADCs) with post-processing hardware, advanced synchronization capabilities and programmable gain amplifiers, along with a sophisticated comparator and digital-to-analog converter subsystem and a sigma-delta filter interface. The new C2000 Piccolo F28004x MCU builds on the generational improvements introduced in the Delfino F2837x and Piccolo F2807x series. These new real-time control solutions offer code compatibility with existing Piccolo MCUs, allowing customers to take advantage of the new family’s unique combination of premium performance in an affordable offering. Pricing, Package & Availability Developers can evaluate the new C2000 F28004x MCUs with the F280049 experimenter kit (TMDXDOCK280049M) available for US$209.00 through the TI store and authorized distributors. Production quantities of the C2000 F28004x MCUs are available in a 64-pin LQFP package, starting at US$4.85 in 1,000-unit quantities.
NXP India Organizes TechStreams Mulls on 5G and Future of Secure Connectivity NXP India lately organized a Panel Discussion as a part of its TechStreams initiative to encourage knowledge sharing and the spirit of innovation. Led by Sarat Vetcha, Director, Digital Networking Software Development, NXP India, the recent Panel discussion at TechStreams was a part of the Emerging Domains stream and focused on ‘5G Technology: What to expect and the challenges’. Some of India’s most valued dignitaries attended the discussion that aimed at deliberating on 5G Technology and its key challenges. The Panel Discussion, chaired by Kumaran Venkatesh, Senior Director, ARM, witnessed participation from industry experts, such as Alok Bardiya, Sr. Executive, IOT, Tata Communications, Subodh Gajare, Sr. Solutions Architect, Cisco R&D, Krishna Sirohi, President, Technology Innovations and Standardization, i2TB, and Dr. Navin Kumar, Associate Professor, Amrita University. Further, the panel discussed how 5G technology carries high expectations with its potential benefits and capabilities. Basic expectations include better battery life, high network reliability as well as guaranteed quality. To accentuate the capability of 5G, the discussion bore out 5G’s capacity of providing everything real time, reducing latency, having a larger bandwidth enabling support on heavy days and enabling massive machine-to-machine communication. Speaking of the initiative, Sanjay Gupta, Vice President & India Country Manager, NXP India said, “India has large technological talent pool and NXP India has perpetually worked towards connecting this pool with similar skills and expertise. TechStreams is one such initiative that has helped broaden NXP India’s horizons of industry knowledge and synergise with fierce thoughts and minds to emerge as a motivator of next generation innovation.” Gupta further said, “This decade will prove to be yet another turning point for engineers as Artificial Intelligence and big data bring in the next wave of innovation. The advent of 5G technologies and ICT networks signify this next wave of a globally connected Digital Society. To create such digital giants of intelligence in India, operators need to address the issues surrounding 5G infrastructure readiness and deployment, regulatory policies and investments. Once these issues are addressed, India is going to witness a massive increase in data consumption, increasing digitalized life and services, growth of smart cities and the need to have a network infrastructure that can utilize all the available spectrum band rather than replace the existing networks.” Discussing about the expectations from 5G, Subodh Gajare, said, “5G systems will have Network Slicing as a key innovative technique to embrace the programmable era. Network Slicing will carve out a single physical infrastructure into multiple virtual networks that would allow service providers to customize services for customers, drawing from a pool of virtual and physical resources. 5G systems are tailor made for slicing model, enabling operators to offer XaaS (anything – as a Service) and meet the demands of the various used cases. Automation Provisioning and interworking of physical and virtual resources will be the new normal for 5G networks and services for mass adoption.” Talking about the challenges and solutions of the 5G Technology, Krishna Sirohi, said, “Infrastructure and services are the major challenges in achieving a 5G enabled India in its entirety. National goals of digital India can only be achieved by establishing sustainable 4G and 5G access networks. Millimetre Wave technology (5G) based terrestrial and satellite backhaul solutions are needed to extend the spread of high data rate network to every village and agricultural land and achieve a digitised agricultural and rural life.” TechStreams is an amalgamation of four technological streams – Security, New Semiconductor Process Technologies, Emerging Domains and High Performance Analog Signals and RF Designs.