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SILEX – Batch-Type IPA-Free Wet Process Equipment | 间歇式无异丙醇（IPA）的湿法处理设备
Advanced cleaning steps are going to become an indispensable part of existing present and future cell lines as a key for further improvement of cell performance and cost reduction. Ozone-based cleaning operations, applied on SILEX wet bench, combine efficient organic and metal removal with appropriate surface conditioning. Due to low chemical cost and consumption, simple process control, and high metal removal efficiency, ozonated acidic cleaning bathes are the perfect substitute for traditional, expensive multi-step RCA cleanings, known from semiconductor industry.
前端电池生产中湿法批量加工应用的第二大支柱在 于湿法清洗。在目前和未来电池生产线上，先进的 清洁程序将成为不可或缺的一环，成为进一步提高 电池性能和降低成本的关键所在。基于臭氧的清洁 操作在SILEX湿台架上进行，在进行表面修整的同时 能有效地去除有机和金属。由于化学品的成本和消 耗量较低，工艺控制简单且金属去除效率较高，根 据大家熟知半导体行业经验，臭氧化酸洗成为传统 昂贵的多步RCA清洗的理想替代品。 德国新格拉斯科技集团为扩散和表面钝化之前的湿 法清洁提供了集成的臭氧处理方案，可集成到新设 备中并为现有SILEX湿台架提供升级。
SINGULUS TECHNOLOGIES provides integrated ozone-based process solutions for wet cleaning prior to diffusion and passivation integrated into new equipment as well as an upgrade of existing SILEX wet benches.
Main Features
主要特点
→→ Proven, highly integrated design →→ High throughput up to max 3,000 wph →→ High availability (uptime > 95 %) →→ Low breakage rate (< 0.05 %) →→ High flexibility in process sequence, wafer type, wafer size →→ Wafer thickness down to 120 μm (post process) →→ Internal automatic chemical bath management →→ Reproducible process results by complex process parameter control →→ Network communication support →→ Carrier tracking and data logging →→ Compliance with international safety regulations.
→→ 成熟而高度集成的设计 →→ 最高达3,000 wph的高产量 →→ 高可靠性（工作时间> 95 %） →→ 低破损率（< 0.05 %） →→ 工序、硅晶片类型、硅晶片尺寸的高度灵活性 →→ 硅晶片厚度薄至120 μm （后期加工） →→ 内部自动化化学水浴管理 →→ 通过复杂的加工参数控制实现可重复加工结果 →→ 网络通信支持 →→ 载流子跟踪和数据记录 →→ 与国际安全规定的符合性