MARKET AND OVERVIEW
Wafer Level Solder Ball Mounter is a piece of equipment in semiconductor manufacturing, mainly used to permanently connect wafers of different materials. As a part of the back-end engineering of semiconductor production, it is mainly used to perform ball bonding on the electrodes in the chip using bonding metal wires and ceramic cleavers before the wafer is cut, and the wire tails are cut to form protruding electrodes (threads). pillar bump) process. After the ball is planted, the protruding electrodes of the chip are connected through the key flip chip process to form an electronic circuit.
MARKET SIZE AND GROWTH
The global Wafer Level Solder Ball Mounter
Market size was estimated at USD 64.20 million in 2023 and is projected to reach USD 121.18 million by 2030, exhibiting a CAGR of 9.50% during the forecast period.
North America Wafer Level Solder Ball
Mounter market size was USD 16.73 million in 2023, at a CAGR of 8.14% during the forecast period of 2025 through 2030.
