The global Wafer Level Solder Ball
Mounter Market size was estimated at USD 64.20 million in 2023 and is projected to reach USD 121.18 million by 2030, exhibiting a CAGR of 9.50% during the forecast period.
CAGR OF 9.50 %
(2025-2032)
• 200mm Wafer
• 300mm Wafer • Others
By Region & Country
