MARKET AND OVERVIEW
Wafer level packaging inspection machines are used to detect pattern defects and physical defects on the wafer. These defects are usually divided into system defects and random defects. Random defects are mainly caused by particles attached to the surface of the wafer, so the spots cannot be predicted. On the other hand, the conditions of the mask and exposure process can cause systematic defects. According to its working principle, wafer inspection machines are divided into patterning machines and non-patterning machines.
MARKET SIZE AND GROWTH
The global Wafer Level Packaging Inspection
Machine Market size was estimated at USD 324.70 million in 2023 and is projected to reach USD 453.85 million by 2030, exhibiting a CAGR of 4.90% during the forecast period.
North America Wafer Level Packaging
Inspection Machine market size was USD 84.61 million in 2023, at a CAGR of 4.20% during the forecast period of 2025 through 2030.
