MARKET AND OVERVIEW
Wafer Inspection and Metrology Systems for Advanced Packaging is combining wafer manufacturing and device encapsulation technologies. WLP is a chip-scalepackaging technology where many IC’s can be stacked together using suitable interconnect processes (like TSV or metal bumps) followed by encapsulation.
Advanced Packaging Inspection Systems is designed to inspect advanced wafer-level packaging process steps, providing information on the full range of defect types for inline process control through multi-mode optics and sensors and advanced defect detection algorithms.
MARKET SIZE AND GROWTH
The global Wafer Inspection and Metrology Systems for Advanced Packaging Market size was estimated at USD 419.70 million in 2023 and is projected to reach USD 647.93 million by 2030, exhibiting a CAGR of 6.40% during the forecast period.
North America Wafer Inspection and Metrology Systems for Advanced Packaging market size was USD 109.36 million in 2023, at a CAGR of 5.49% during the forecast period of 2025 through 2030.
