The global Wafer Grinding Tapes
Market size was estimated at USD 195 million in 2023 and is projected to reach USD 272.56 million by 2030, exhibiting a CAGR of 4.90% during the forecast period.
CAGR OF 4.90 %
(2025-2032)
By Type :
• UV Type • Non-UV Type
By Application :
• Standard
• Standard Thin Die
• (S)DBG(GAL)
• Bump
By Region & Country
