• The global Vacuum Soldering System market was valued at USD 130.79 million in 2023 and is expected to reach USD 227.09 million by the end of 2030, growing at a CAGR of 8.2% between 2024 and 2030.
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• Global key Vacuum Soldering System players include Rehm Thermal Systems, SMT Wertheim, Kurtz Ersa, Budatec GmbH, PINK, Centrotherm, Heller Industries, BTU International, ASSCON, Origin, Palomar Technologies, Shinko Seiki, Shenzhen JT Automation and Quick Intelligent etc. The top 3 companies hold a share about 45.77%. Asia is the largest market with a share about 54.89%, followed by North America and Europe. In terms of product, Inline Vacuum Soldering System is the largest segment with a share about 56.55%. And in terms of applications, the largest application is Power Semiconductors with a share about 67.07%.
• The demand for high-performance electronics is growing worldwide, driven by higher demand from for example the electro-mobility and LED global lighting industries. These different electronic applications require solder joints with as few voids as possible in both their structure and connection. To produce solder joints with very few voids consistently, soldering systems with vacuum chambers are essential for removing the gases from the molten solder joint once the solder paste has been remelted.
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By
Types
• Inline Vacuum Soldering System • Batch Vacuum Soldering System
Power Semiconductors
LEDs
High-reliability Semiconductors & MEMS
Others
• Rehm Thermal Systems • SMT Wertheim • Kurtz Ersa • Budatec GmbH • PINK • Centrotherm • Heller Industries
