MARKET AND OVERVIEW
When high reliability small microcircuit applications are required, Transistor Outline (TO) headers offer a good packaging solution.
TO Headers are often used in housing transistors and integrated circuits with low lead counts. They are hermetically sealed to protect the device from moisture and contaminants.
Headers are available in a large range of sizes and leads to work with many applications.
MARKET SIZE AND GROWTH
The global TO Headers market size was estimated at USD 295.50 million in 2023 and is projected to reach USD 456.19 million by 2030, exhibiting a CAGR of 6.40% during the forecast period.
North America TO Headers market size was USD 77.00 million in 2023, at a CAGR of 5.49% during the forecast period of 2025 through 2030.
