Through Glass Via (TGV) Substrate Market, Emerging Trends, Technological Advancements, and Business

Page 1


MARKET OVERVIEW

The global TGV substrate market is moderately concentrated, with the top five players accounting for approximately 73% of the market share. Major players include:

Corning LPKF
KISO WAVE Co., Ltd.
Samtec

MARKET SIZE & GROWTH

• The global Through Glass Via (TGV) Substrate Market was valued at USD 117 million in 2024.

• It is projected to reach USD 507 million by 2031.

• The market is expected to grow at a CAGR of 23.8% during the forecast period.

MARKET SEGMENTATION

BY TYPE: BY APPLICATION:

• 300 mm Wafer

• 200 mm Wafer

• 150 mm Wafer

• Consumer Electronics

• Automobile Industry

• Others

KEY PLAYERS

BY REGION AND COUNTRY

NORTH AMERICA

EUROPE

SOUTH AMERICA

ASIA-PACIFIC

MIDDLE EAST AND AFRICA

Turn static files into dynamic content formats.

Create a flipbook
Issuu converts static files into: digital portfolios, online yearbooks, online catalogs, digital photo albums and more. Sign up and create your flipbook.