MARKET OVERVIEW
Through-Silicon Via (TSV) is a cuttingedge circuit interconnection technology that enables vertical electrical connections between chips and between wafers. Unlike traditional IC packaging bonding and dot coating stacking methods, TSV maximizes chip stacking density in the three-dimensional direction.
MARKET SIZE & GROWTH
• The global Through-Silicon Vias (TSVs) Market was valued at USD 2,639 million in 2023.
• It is projected to reach USD 7,689 million by 2030.
• The market is expected to grow at a CAGR of 15.7% during the forecast period.
