Thin Film Ceramic Substrates in Electronic Packaging Boards Market Size & Growth :
The global Thin Film Ceramic Substrates in Electronic Packaging Market was valued at 60.5 million in 2024 and is projected to reach US$ 93 million by 2031, at a CAGR of 6.5% during the forecast period.
CAGR OF 6.5 %
(2025-2032)
Alumina Thin Film Ceramic Substrates •AlN Thin Film Ceramic Substrates
Vishay
Cicor Group