Report Overview:
Thick film hybrid integrated circuit (THIC) is a kind of hybrid integrated circuit, which is made of passive network on the same substrate by thick film process such as screen printing and sintering, and then assembled with discrete semiconductor chip or monolithic integrated circuit or micro component, and then packaged.
The characteristics of thick film hybrid integrated circuit: compared with discrete component circuit, hybrid integrated circuit has the characteristics of high density, high reliability and better electrical performance; compared with PCB Compared with monolithic integrated circuit, it is flexible in design, simple in process, convenient in production of many varieties and small batch, and has wide parameter range, high precision, and can withstand high voltage and large output In terms of digital circuits, although semiconductor integrated circuits give full play to the characteristics of miniaturization.
Market Value:
The Global Thick-Film Hybrid Integrated Circuits Market Size was estimated at USD 5997.98 million in 2023 and is projected to reach USD 7992.05 million by 2029, exhibiting a CAGR of 4.90% during the forecast period.
CAGR of 4.90%
(2024 – 2030)
