Introduction to Thermal Copper Pillar Bump :
A thermal copper pillar bump is a component used in electronics packaging to improve heat dissipation and electrical connection. It consists of a small copper pillar or post that is placed between the semiconductor chip and the substrate or circuit board. This bump helps to efficiently transfer heat away from the chip and enhance the mechanical and electrical connection between the chip and its mounting surface.
Thermal Copper Pillar Bump Market Size & Growth :
The Global Thermal Copper Pillar Bump Market was valued at US$ 110.8 million in 2024 and is projected to reach US$ 178.4 million by 2030, exhibiting a Compound Annual Growth Rate (CAGR) of 7.6% during the forecast period (2024-2030).
CAGR OF 7.6 % (2024-2030)
By Region & Country
