TGV Glass Core Substrate Market was valued at 188 million in 2024 and is projected to reach US$ 594 million by 2032, at a CAGR of 17.4% during the forecast period
Report Studies
• The global TGV Glass Core Substrate Market was valued at 188 million in 2024 and is projected to reach US$ 594 million by 2032, at a CAGR of 17.4% during the forecast period.
• TGV (Through Glass Via) Glass Core Substrate is an advanced semiconductor packaging material that uses glass as the core layer, enabling high-density electrical interconnections through precisiondrilled vias. This technology offers superior thermal management, excellent signal integrity, and dimensional stability compared to traditional organic substrates like FC-BGA. Key attributes include a low coefficient of thermal expansion (CTE), high flatness for finepitch applications, and panel-level manufacturability advantages.
Email: help@semiconductorinsight.com
By Type:
• The market is segmented based on coefficient of thermal expansion (CTE) into:
• Coefficient of Thermal Expansion (CTE), above 5 ppm/°C
• Coefficient of Thermal Expansion (CTE), below 5 ppm/°C
By Application:
• The market is segmented based on application into:
• Wafer Level Packaging
• Panel Level Packaging
• AGC Inc. (Japan)
• Schott AG (Germany)
• Corning Incorporated (U.S.)
• Hoya Corporation (Japan)
• Ohara Corporation (Japan)
• Dai Nippon Printing (DNP) (Japan)
• Nippon Electric Glass (NEG) (Japan)
