Semiconductor Wafer Grinding Equipment Market was valued at 1096 million in 2024 and is projected to reach US$ 1834 million by 2032, at a CAGR of 7.6% during the forecast
Report Studies
• The global Semiconductor Wafer Grinding Equipment Market was valued at 1096 million in 2024 and is projected to reach US$ 1834 million by 2032, at a CAGR of 7.6% during the forecast period.
• Semiconductor wafer grinding equipment is specialized machinery crucial for achieving the precise thickness and surface quality required in semiconductor manufacturing. This equipment facilitates the mechanical process of thinning wafers to exact specifications, encompassing various critical steps such as coarse grinding, fine grinding, and stress relief. The primary types of equipment include Wafer Surface Grinders, which dominate the market with an estimated 87% share, and Wafer Edge Grinders. Email: help@semiconductorinsight.com
By Application:
• The market is segmented based on application into:
• Silicon Wafer
• Compound Semiconductors
Key Players:
• Disco Corporation (Japan)
• TOKYO SEIMITSU (ACCRETECH) (Japan)
• Okamoto Semiconductor Equipment Division (Japan)
• G&N Genauigkeits-Maschinenbau Nürnberg GmbH (Germany)
• Revasum (U.S.)
• Koyo Machinery Industries Co., Ltd. (Japan)
• WAIDA MFG. CO., LTD. (Japan)
