Semiconductor Packaging Materials Market, Emerging Trends, Technological Advancements, and Business

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MARKET OVERVIEW

Semiconductor packaging serves four primary functions:

Protection: Safeguards chips from environmental damage.

Support: Physically supports the semiconductor die.

Connection: Links the chip to the circuit board via electrical pathways.

Reliability: Ensures long-term performance and functionality.

MARKET SIZE & GROWTH

• The global Semiconductor Packaging Materials Market was valued at $31,260 million in 2024.

• It is projected to reach $76,960 million by 2031.

• The market is expected to grow at a CAGR of 14.1% during the forecast period.

MARKET SEGMENTATION

BY TYPE: BY APPLICATION:

• Packaging Substrate

• Lead Frame

• Bonding Wire

• Encapsulating Resin

• Consume Electrons

• Automobiles

• Communications

KEY PLAYERS

Kyocera
Shinko
Ibiden
LG Innotek
Semco

BY REGION AND COUNTRY

NORTH AMERICA

EUROPE

SOUTH AMERICA

ASIA-PACIFIC

MIDDLE EAST AND AFRICA

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