MARKET OVERVIEW
DCB (Direct Bonded Copper) substrates are made by bonding pure copper onto ceramic insulators like Al₂O₃ or AlN through a hightemperature eutectic process.
AMB (Active Metal Brazing) is an advanced method that brazes copper onto AlN or SiN ceramics, allowing thicker copper layers (up to 800µm) on thin substrates (0.25mm), offering excellent thermal conductivity and reliability.
MARKET SIZE & GROWTH
• The global Power Electronic DCB & AMB Substrates Market was valued at $1,155 million in 2024.
• It is projected to reach $3,756 million by 2031.
• The market is expected to grow at a CAGR of 18.8% during the forecast period.
