



The cleaning process typically involves using specialized cleaning solutions or chemicals, such as acidic or alkaline cleaners, to remove the residues and particles. Various techniques may be utilized, including ultrasonic cleaning, plasma cleaning, or electrochemical cleaning, depending on the specific requirements and characteristics of the semiconductor.
Post CMP cleaning plays a crucial role in enhancing the yield and functionality of semiconductors, as it ensures the cleanliness and integrity of the substrate surface.
By removing any contaminants left behind by the CMP process, post CMP cleaning contributes to the overall quality and performance of the final semiconductor product.
The demand for high-performance integrated circuits (ICs) is on the rise across various applications, including smartphones, tablets, laptops, and servers. These applications require ICs that offer high speed, low power consumption, and exceptional reliability. Post CMP cleaning plays a critical role in ensuring the optimal performance and reliability of these ICs.
The global Post CMP Cleaning market was valued at US$ 193.6 million in 2022 and is projected to reach US$ 319.8 million by 2029, at a CAGR of 7.4% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes. CAGR of
Acidic Cleaners
Alkaline Cleaners
Solvent-based Cleaners
Metal Impurities and Particles
Organic Residue
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