MARKET AND OVERVIEW
The market is driven by the rising demand for highperformance ceramic substrates in consumer electronics, automotive, and aerospace applications. LTCC (Low-Temperature Co-Fired Ceramic) and HTCC (High-Temperature Co-Fired Ceramic) substrates are widely used for their superior thermal stability, electrical insulation, and high-frequency performance. This report studies the Passive and Interconnecting Electrical Componentss, include two types, LTCC and HTCC Ceramic Substrates.
MARKET SIZE AND GROWTH
The global Passive and Interconnecting Electrical
Components Market size was estimated at USD 642.30 million in 2023 and is projected to reach USD 903.78 million by 2030, exhibiting a CAGR of 5.00% during the forecast period.
North America Passive and Interconnecting Electrical
Components market size was USD 167.37 million in 2023, at a CAGR of 4.29% during the forecast period of 2025 through 2030.
