MARKET OVERVIEW
The rising adoption of electric vehicles, renewable energy systems, and advanced power electronics is driving the demand for high-performance packaging materials. Innovations in encapsulation, die attach, ceramic substrates, and thermal interface materials are enhancing the efficiency and durability of IGBT and SiC modules
MARKET SIZE & GROWTH
The global Packaging Materials for IGBT and SiC Modules Market size was estimated at USD 2284 million in 2023 and is projected to reach USD 3572.70 million by 2030, exhibiting a CAGR of 6.60% during the forecast period.
North America Packaging Materials for IGBT and SiC Modules market size was USD 595.15 million in 2023, at a CAGR of 5.66% during the forecast period of 2025 through 2030.
