• The global Optical Communication IC market size was estimated at USD 3045.70 million in 2023 and is projected to reach USD 9004.70 million by 2032, exhibiting a CAGR of 12.80% during the forecast period.
• North America Optical Communication IC market size was estimated at USD 977.32 million in 2023, at a CAGR of 10.97% during the forecast period of 2025 through 2032.
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• In optical devices, optical chips are used for the conversion of photoelectric signals. According to the type of light emission, it is divided into surface emission and side emission. Among them, surface-emitting lasers are mainly VCSEL (vertical cavity surface-emitting lasers); there are many types of edge-emitting lasers, including FP (FabryPérot, Fabry-Perot laser), DFB (Distributed Feedback Laser, distributed feedback laser) Lasers) and EML (Electroabsorption Modulated Laser), traditional FP laser chips have gradually narrowed their applications in the field of optical communication due to large losses and short transmission distances. There are three main types of core laser chips: DFB and EML And VCSEL.
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II-VI Incorporated (Finisar)
Lumentum (Oclaro)
Broadcom
Sumitomo Electric
Accelink Technologies
Hisense Broadband
