Optical Active Device Chip Market size was valued at US$ 4.67 billion in 2024 and is projected to reach US$ 8.89 billion by 2032, at a CAGR of 9.6% during the forecast period 2025-2032.
Report Studies
• The global Optical Active Device Chip Market size was valued at US$ 4.67 billion in 2024 and is projected to reach US$ 8.89 billion by 2032, at a CAGR of 9.6% during the forecast period 2025-2032.
• Optical active device chips are semiconductor components that generate, detect, or manipulate light signals in photonic systems. These chips include various types such as FP (Fabry-Pérot) chips, DFB (Distributed Feedback) chips, EML (Electro-absorption Modulated Laser) chips, VCSEL (Vertical Cavity Surface
Emitting Laser) chips, PIN (Positive-Intrinsic-Negative) photodiodes, and APD (Avalanche Photodiode) chips. They play a crucial role in optical communication systems, enabling high-speed data transmission across telecommunications networks, data centers, and consumer electronics.
By Type:
• The market is segmented based on type into:
• FP Chip
• Subtypes: Single-mode, multi-mode
• DFB Chip
• EML Chip
• VCSEL Chip
• Subtypes: Single-mode VCSEL, multi-mode VCSEL
• PIN Chip
• APD Chip
• Others
• The market is segmented based on application into:
• 5G Base Station
• Data Center
• Consumer Electronic
• Automotive
• Industrial
• Others
• II-VI Incorporated (Coherent Corp) (U.S.)
• Lumentum Holdings Inc. (U.S.)
• Broadcom Inc. (U.S.)
• Mitsubishi Electric Corporation (Japan)
• Yuanjie Semiconductor Technology Co., Ltd. (China)
• EMCORE Corporation (U.S.)
• Sumitomo Electric Industries, Ltd. (Japan)
• Accelink Technologies Co., Ltd. (China)
