MIS Substrate Market was valued at 89.1 million in 2024 and is projected to reach US$ 219 million by 2032, at a CAGR of 13.2% during the forecast period
Report Studies
• The global MIS Substrate Market was valued at 89.1 million in 2024 and is projected to reach US$ 219 million by 2032, at a CAGR of 13.2% during the forecast period.
• A Molded Interconnect Substrate (MIS) is an advanced packaging technology that integrates a pre-molded structure with fine-pitch circuitry, serving as a hybrid between a traditional lead frame and a coreless substrate. This technology enables ultra-fine line/space capabilities and is compatible with various package types, including QFN, LGA, BGA, and SIP. It is widely applicable in IC packaging processes such as wire bonding (WB), flip-chip (FC), and surfacemount technology (SMT).
By Type:
• The market is segmented based on type into:
• Single-layer MIS
• Multi-layer MIS
• Subtypes: 2-layer, 3-layer, 4-layer, 6-layer, and others
By Application:
• The market is segmented based on application into:
• Power IC
• RF/5G
• Fingerprint Sensor
• OIS (Optical Image Stabilization)
• Others
• Subtypes: Automotive electronics, LED packaging, GaN devices, and thirdgeneration semiconductors
• PPt Corporation (Taiwan)
• MiSpak Technology (China)
• QDOS International Sdn Bhd (Malaysia)
