The global Low PIM Assemblies market size was valued at US$ 234.56 million in 2024 and is projected to reach US$ 378.92 million by 2032, at a CAGR of 7.12% during the forecast period 2025–2032
Report Studies
• The global Low PIM Assemblies market size was valued at US$ 234.56 million in 2024 and is projected to reach US$ 378.92 million by 2032, at a CAGR of 7.12% during the forecast period 2025–2032. The U.S. market accounted for approximately 32% of global revenue in 2024, while China is expected to grow at a faster 7.9% CAGR through 2032.
• Low PIM (Passive Intermodulation) assemblies are specialized RF components designed to minimize signal distortion in high-frequency communication systems. These precision-engineered products include SMA, Mini DIN, and Type-N cable assemblies, which are critical for maintaining signal integrity in applications like 5G networks and distributed antenna systems. The growing demand stems from their ability to reduce interference in multi-carrier environments where signal clarity is paramount.
By
Type:
• The market is segmented based on type into:
• SMA Low PIM Cable Assemblies
• Subtypes: Straight connectors, right-angle connectors
• Mini DIN Low PIM Cable Assemblies
• Type-N Low PIM Cable Assemblies
• Subtypes: Standard N-type, flush N-type
• Others
By Application:
• The market is segmented based on application into:
• Distributed Antenna System (DAS)
• Flame Retardant Installation
• Multi-carrier Communication System
• PIM Test
• Other Applications
• Times Microwave Systems (U.S.)
• Fairview Microwave (U.S.)
• RD Microwaves (U.S.)
• HUBER+SUHNER (Switzerland)
• K&L Microwave (U.S.)
• Gamma Electronics (U.S.)
• Meca Electronics (U.S.)
• San-tron (U.S.)
