MARKET OVERVIEW
Lead Frame is the basic component that delivers electric signal to external circuits and supports the chip inside of semiconductor package mechanically. A lead frame consists of a die mounting paddle and lead fingers. The die paddle serves primarily to mechanically support the die during package manufacture. The lead fingers connect the die to the circuitry external to the package.
MARKET SIZE & GROWTH
• The global IC and LED Lead Frames Market was valued at USD 3,546 million in 2024.
• It is projected to reach USD 5,210 million by 2031.
• The market is expected to grow at a CAGR of 5.8% during the forecast period.
BY
• DIP
• SOP
• SOT
• QFP
• DFN
• QFN
