US$ 387.5 million in 2024 and is projected to reach US$ 642.9 million by 2032, at a CAGR of 7.4% during the forecast period 2025-2032
Report Studies
• The global High Heat-resistant and Low Thermal Compaction Glass Substrate
Market size was valued at US$ 387.5 million in 2024 and is projected to reach US$ 642.9 million by 2032, at a CAGR of 7.4% during the forecast period 2025-2032.
• High heat-resistant and low thermal compaction glass substrates are essential components in advanced display technologies, characterized by their ability to withstand high temperatures while minimizing dimensional changes. These ultrathin, ultra-flat glass sheets are primarily used in liquid crystal displays (LCDs) and emerging display applications, offering superior thermal stability and optical clarity compared to conventional glass substrates.
By Type:
• The market is segmented based on type into:
• Alkali Glass
• Subtypes: Borosilicate, Aluminosilicate, and others
• E-glass
By Application:
• The market is segmented based on application into:
• Cell Phone
• Computer
• Others
• Subtypes: Automotive displays, Medical devices, Wearable electronics
• Corning Incorporated (U.S.)
• AGC Inc. (Japan)
• Nippon Electric Glass (Japan)
• SCHOTT AG (Germany)
• Neyco (France)
• Tunghsu Optoelectronic (China)
• AvanStrate Inc. (Japan)
