On : 13 february 2025
• As of 2024, the global High-End PCB market is valued at approximately US$ 68.3 billion. It is expected to grow at a CAGR of 4.86%, reaching US$ 98.4 billion by 2031. The Asia-Pacific region dominates the market, accounting for over 85% of global production, with China Mainland, Taiwan, and South Korea leading the charge.
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• The High-End Printed Circuit Board (PCB) market encompasses the production and distribution of advanced PCB types, including multilayer, High-Density Interconnect (HDI), IC substrates, and flexible PCBs. These PCBs serve critical applications in industries such as telecommunications, automotive electronics, consumer electronics, aerospace, and industrial automation. High-end PCBs are designed to support high-frequency, highspeed, and high-power applications, making them essential for emerging technologies such as 5G, AI, and electric vehicles.
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By
Others
Multilayer PCB (43.79% market share)
HDI PCB
IC Substrate
Flexible PCB (FPC)
• Unimicron
• Zhen Ding Technology
• DSBJ (Dongshan Precision)
• Kinwong
• Shennan Circuit
• Tripod Technology
• Suntak Technology
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