


High Bandwidth Memory (HBM) is a type of dynamic random-access memory (DRAM) that offers high-speed data transfer between a processor and the memory.
HBM is designed to overcome the limitations of traditional memory architectures, such as DDR4 and GDDR5, by providing a wider data bus and significantly higher bandwidth, which is essential for high-performance computing applications.
The global High Bandwidth Memory (HBM) Market was valued at US$ 856.78 million in 2023 and is anticipated to reach US$ 48,925.41 million by 2030, Witnessing a CAGR of 68.08% during the forecast period 2024-2030.
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