• The "Global Heat Resistant Phenolic Molding Compound Market" size was valued at US$ 678.9 million in 2024 and is projected to reach US$ 956.7 million by 2030, at a CAGR of 5.9% during the forecast period 2024-2030.
• The "United States Heat Resistant Phenolic Molding Compound Market" size was valued at US$ 189.4 million in 2024 and is projected to reach US$ 256.7 million by 2030, at a CAGR of 5.2% during the forecast period 2024-2030.
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• The global Heat Resistant Phenolic Molding Compound market is growing robustly, driven by hightemperature applications. In 2023, total production reached 320,000 metric tons, with automotive under-hood components accounting for 40% of demand. The aerospace segment is growing at 7.2% annually. The market saw a 20% increase in demand for ultra-high temperature grades in 2023. Standard heat-resistant grades dominate with a 65% market share, while ultra-high temperature grades are growing at 8% annually. Asia Pacific leads with a 45% market share, while China is the fastest-growing region at 7.0% CAGR. The industry is focusing on developing advanced heat-resistant formulations, with a 25% growth in R&D investments.
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• Press Molding Compound • Injection Molding Compound
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