Global Through- Silicon Vias ( TSVs) Market, Parts Emerging Trends Size & Growth
The Global Through-Silicon Vias (TSVs) Market size was estimated at USD 1796.10 million in 2023 and is projected to reach USD 7563.44 million by 2030, exhibiting a CAGR of 22.80% during the forecast period.
CAGR OF 22.80%
(2025-2032)
•2.5D Through-Silicon Vias
•3D Through-Silicon Vias
By Region & Country
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