Global Through-Silicon Vias Market Size & Growth :
The Global ThroughSilicon Vias (TSVs)
Market size was estimated at USD 1796.10 million in 2023 and is projected to reach USD 7563.44 million by 2030, exhibiting a CAGR of 22.80% during the forecast period.
CAGR OF 22.80 %
(2025-2032)
By Region & Country
