Published On : February 2024 Email: help@24marketreports.com Global Semiconductor Die Attach Materials Market Research Report 2024(Status and Outlook)
Studies
• Typical die-attach materials are PbSn, PbSnAg or PbInAg alloys. These alloys wet conventional substrates and die metallizations due to the formation of intermetallic compounds, which build an adhesion layer between substrate or die metallization and bulk solder.
• To achieve the best wetting and lowest void rate, the solder material should contain the lowest possible oxide content.
• The die-attach layer has two main functions: mechanical fixation of the die on its substrate, and dissipation of heat generated in the die. Especially in power and high-power applications, generated heat density is high.
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Report
Email: help@24marketreports.com Call: +1(646)-781-7170 (Int'l) By Types Die Attach Paste Die Attach Wire
Email: help@24marketreports.com Call: +1(646)-781-7170 (Int'l) By Applications • Consumer Electronics • Automotive • Medical • Telecommunications • Others $0 $10,000 $20,000 $30,000 $40,000 $50,000 $0 $5,000 $10,000 $15,000 $20,000 $25,000 $30,000 $35,000
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