Global Semiconductor Backside Grinding Tape Market size was valued at US$ 234.8 million in 2024 and is projected to reach US$ 378.4 million by 2032, at a CAGR of 7.1% during the forecast period 20252032
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• The Global Semiconductor Backside Grinding Tape Market size was valued at US$ 234.8 million in 2024 and is projected to reach US$ 378.4 million by 2032, at a CAGR of 7.1% during the forecast period 2025-2032.
• Semiconductor backside grinding tapes are specialized adhesive films used during wafer thinning processes to protect circuit patterns and maintain structural integrity. These tapes consist of a base film, adhesive layer, and release liner, playing a critical role in semiconductor manufacturing by preventing wafer breakage and contamination during backgrinding operations. The product types primarily include UV-curable tapes (which lose adhesion under UV exposure) and non-UV tapes (removed through thermal or mechanical methods).
• Mitsui Chemicals Tohcello (Japan)
• Nitto Denko Corporation (Japan)
• LINTEC Corporation (Japan)
• Furukawa Electric Co., Ltd. (Japan)
• Denka Company Limited (Japan)
• D&X (South Korea)
• AI Technology, Inc. (U.S.)
