Global Reflow Oven for semiconductor Packaging Market Size & Growth :
The Global Reflow Oven for Semiconductor Packaging Market size was valued at US$ 892.5 million in 2024 and is projected to reach US$ 1.3 billion by 2030, at a CAGR of 7.0% during the forecast period 2024-2030.
CAGR OF 7.0%
(2024-2030)
Market Segmentation :
By Type:
•Convection Reflow Oven
•Vapour Phase Reflow Oven
Market Segmentation (by Application)
•Wafer Ball Mounting
•Wafer Bumping
•Wafer Die Bonding
By Region & Country
