Global High Thermal Conductivity Sintering Die Attach Adhesives Market Parts Emerging Trends Size & Growth
The Global High Thermal Conductivity Sintering Die Attach Adhesives Market size was estimated at USD 165 million in 2023 and is projected to reach USD 229.09 million by 2030, exhibiting a CAGR of 4.80% during the forecast period.
CAGR OF 4.80%
(2025-2032)
By Type:
•Pressure Sintering
•Pressure-less Sintering
By Application :
•Power Equipment •Electronics and Optoelectronics •Wireless Infrastructure
Others
By Region & Country
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