Report Overview:
Copper Conductive Paste is a specialized material used for creating electrical connections in electronic devices, printed circuit boards (PCBs), and various electronic components. It is composed of copper particles suspended in a binder material, often a polymer resin or solvent, which allows for the paste to be applied and cured onto substrates to form conductive pathways.
This report provides a deep insight into the global Copper Conductive Paste market covering all its essential aspects. This ranges from a macro overview of the market to micro details of the market size, competitive landscape, development trend, niche market, key market drivers and challenges, SWOT analysis, Porters five forces analysis, value chain analysis, etc.
Market Value:
The Global Copper Conductive Paste Market Size was estimated at USD 213.44 million in 2023 and is projected to reach USD 257.84 million by 2029, exhibiting a CAGR of 3.20% during the forecast period.
CAGR of 3.20%
(2022
– 2029)
By Types:
•Low Temperature Sintered
•Medium Temperature Sintered
•High Temperature Sintered
Key players include:
• Ampletec
• Chang Sung Corporation
• Fenghua Advanced Technology
• Heraeus
• Material Concept
• Mitsuboshi Belting
• Shoei Chemical
• Sinocera
• Sumitomo Metal Mining
