Report Overview:
A FOUP is a specialized container designed to safely transport, store, and protect silicon wafers during various stages of the semiconductor manufacturing process. It has a frontopening mechanism that allows wafers to be loaded and unloaded robotically without exposing the wafers to the surrounding environment. FOUPs are used to maintain the cleanliness and integrity of wafers, protecting them from contamination, particles, and other factors that could negatively affect the quality of the manufactured chips.
FOUPs often have sophisticated features, such as interlocks, sensors, and RFID (RadioFrequency Identification) tags, that help ensure the proper handling and tracking of wafers within the cleanroom environment. These containers are an integral part of automated material handling systems within semiconductor fabrication facilities.
Market Value:
The Global 300 mm Wafer FOUP and FOSB Market Size was estimated at USD 750.43 million in 2023 and is projected to reach USD 1138.89 million by 2029, exhibiting a CAGR of 7.20% during the forecast period.
(2022 – 2029)
By Types:
By Applications:
Wafer Foundry
Key players include:
•Entegris
•Shin-Etsu Polymer
•Miraial
•Chuang King Enterprise
•Gudeng Precision
•3S Korea
