Glass Substrate for Semiconductor Packaging Market Research Report 2025-2032

Glass Substrate for Semiconductor Packaging Market Size & Growth :

The global Glass Substrate for Semiconductor Packaging Market was valued at 195 million in 2024 and is projected to reach US$ 572 million by 2031, at a CAGR of 17.0% during the forecast period.

CAGR OF 17.0 %

(2025-2032)

Market Segmentation

By Type :

•Coefficient of Thermal Expansion (CTE), above 5 ppm/°C

•Coefficient of Thermal Expansion (CTE), below 5 ppm/°C

By Application :

•Wafer Level Packaging

•Panel Level Packaging

By Region & Country

Hoya

Ohara