MARKET OVERVIEW
Flip Chip Ball Grid Array is a mid-cost, high-performance, semiconductor packaging solution that utilizes the controlled collapse chip connection technology, also known as flip chip, for its die to substrate interconnection. FC BGA provides the design flexibility for much higher signal density and functionality into a smaller die and packaging footprint.
MARKET SIZE & GROWTH
• The global FC BGA Market was valued at US$ 5,286 million in 2024.
• It is projected to reach US$ 10,420 million by 2031.
• The market is expected to grow at a CAGR of 10.4% during the forecast period.
