Published On : 24 february 2025
• The global Epoxy Molding Compounds market was valued at US$ 2,241.1 million in 2022 and is projected to reach US$ 3,002.8 million by 2029, growing at a CAGR of 4.3% during the forecast period. The increasing demand for electronic devices and advancements in semiconductor technology are key drivers fueling market growth.
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• Epoxy Molding Compounds (EMC) are thermosetting plastic materials used for semiconductor encapsulation, providing protection against moisture, chemicals, and physical impact. These compounds play a vital role in consumer electronics, automotive, and industrial applications, enhancing durability and reliability.
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By Types • Solid EMC (80% market share) • Liquid EMC
Memory
Non-memory (Largest Segment)
Discrete
Power Module
