


Molding Compound (EMC)

Molding Compound (EMC)
The prime objective of this report is to provide the insights on the post COVID-19 impact which will help market players in this field evaluate their business approaches. Also, this report covers market segmentation by major market vendors, types, applications/end users and geography(North America, East Asia, Europe, South Asia, Southeast Asia, Middle East, Africa, Oceania, South America).
The global Epoxy Molding Compound (EMC) for Semiconductor market was valued at US$ million in 2023 and is projected to reach US$ million by 2030, at a CAGR of % during the forecast period.
2024
Base year
Forecast year
Expected to reach USD 9250.28 million by the end of
2030
Download Sample Report
• Chapter 1 Industry Overview
• Chapter 2 Global Epoxy Molding Compound (EMC) for Semiconductor Market Size
• Chapter 3 Epoxy Molding Compound (EMC) for Semiconductor Market Analysis
• Chapter 4 Global Epoxy Molding Compound (EMC) for Semiconductor Market, 2024 & 2030
Know more
Download Sample Report
• Lead Frame (DIS and DIP)
• Substrate (BGA and CSP)
• Power Devices
https://www.24chemicalresearch.com/downloadsample/277033/global-epoxy-molding-compound-forsemiconductor-market-2024-311