Epoxy-Based Thermal Conductive Adhesives Market: Innovations Driving Electronics Cooling Efficiency

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Epoxy-Based Thermal Conductive Adhesives Market

Industry Outlook: Strategic Insights & Growth Analysis 2025-2032

MARKET SIZE

USD 1,230 million in 2024

USD 1,980 million by 2032 CAGR of 6.1%

MARKET DRIVERS

Growing Demand for HighPerformance Electronics to Fuel Market Expansion

Advancements in EV Battery Technology Creating New Applications

Miniaturization Trend in Electronics Demanding Enhanced Thermal Solutions

MARKET SEGMENTATION

• 01

VISION BY TYPE

High Thermal Conductivity

BY APPLICATION

• 01 Battery Thermal

• 02 Medium and Low Thermal Conductivity

• 02 Heat Sink

KEY PLAYERS

• Henkel

• 3M Company

• H.B. Fuller

• Masterbond

REGIONAL ANALYSIS

Asia-Pacific commands the largest market share at 48%, fueled by massive electronics production in China, South Korea, and Taiwan.

Europe shows steady growth, particularly in automotive and industrial applications, supported by stringent energy efficiency regulations. 01 02 03

North America follows closely, with the U.S. leading in high-performance electronic applications and aerospace thermal solutions

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