Report Overview:
The global key manufacturers of Electronic Adhesives for PCB Assembly include Henkel, 3M, Namics, ITW, Dow, Huntsman, Delo, Parker and H.B. Fuller, etc. in 2023, the global top five players have a share approximately % in terms of revenue.
This report aims to provide a comprehensive presentation of the global market for Electronic Adhesives for PCB Assembly, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Electronic Adhesives for PCB Assembly
Market Value:
The global Electronic Adhesives for PCB Assembly market was valued at US$ 4.5 billion in 2023 and is projected to reach US$ 8.5 billion by 2030, at a CAGR of 6.1% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
CAGR of
6.1%
(2024 – 2030)
By Types:
• UV Adhesives
• Board-Level Encapsulants
• Module Assembly Adhesives
• Board Level Underfill
