CAGR Value:
The global Dicing Blades for Semiconductor Packaging Market size was valued at US$ 267.3 million in 2024 and is projected to reach US$ 446.7 million by 2032, at a CAGR of 6.7% during the forecast period 2025-2032
Report Studies
• The global Dicing Blades for Semiconductor Packaging Market size was valued at US$ 267.3 million in 2024 and is projected to reach US$ 446.7 million by 2032, at a CAGR of 6.7% during the forecast period 2025-2032. This growth aligns with the broader semiconductor industry expansion, which was valued at USD 579 billion in 2022 and is expected to reach USD 790 billion by 2029 at 6% CAGR.
• Dicing blades are precision cutting tools used in semiconductor manufacturing for wafer singulation – the process of separating individual chips from silicon wafers.
These blades utilize diamond abrasives to achieve micron-level precision cuts while minimizing chipping and thermal damage. The market offers two primary configurations: hubless type for high-precision applications and hub type for standard production needs, with hubless blades currently holding 62% market share.
By Type:
• The market is segmented based on type into:
• Hubless Type
• Subtypes: Resin-bonded, Metalbonded, Electroplated, and others
• Hub Type
• Subtypes: Nickel-based, Phenolic resin-based, and others
By Application:
The market is segmented based on application into:
300mm Wafer
200mm Wafer
Others (150mm and smaller wafers)
• DISCO Corporation (Japan)
• ADT (Advanced Dicing Technologies) (Israel)
• Kulicke & Soffa (K&S) (Singapore)
• Ceiba Technologies (U.S.)
• UKAM Industrial Superhard Tools (U.S.)
• Kinik Company (Taiwan)
