



A BSOI Wafer is a specialized substrate used in semiconductor manufacturing, featuring a thin silicon layer separated from the bulk silicon substrate by a buried oxide (BOX) layer. This structure is created by bonding two silicon wafers and is widely used in high-performance and low-power electronics due to its superior electrical and thermal properties.
• The global BSOI Wafers Market was valued at $918 million in 2023.
• It is projected to reach $1,465 million by 2030.
• The market is expected to grow at a CAGR of 6.8% during the forecast period.
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