MARKET OVERVIEW
Advanced Interconnect Packaging Inspection and Metrology System is combining wafer manufacturing and device encapsulation technologies. WLP is a chip-scalepackaging technology where many IC”s can be stacked together using suitable interconnect processes (like TSV or metal bumps) followed by encapsulation.
MARKET SIZE & GROWTH
• The global Advanced Interconnect Packaging Inspection and Metrology Systems Market was valued at USD 384 million in 2024.
• It is projected to reach USD 606 million by 2031.
• The market is expected to grow at a CAGR of 6.9% during the forecast period.
