Through Glass Via Substrates Market size was valued at US$ 456.80 million in 2024 and is projected to reach US$ 1.23 billion by 2032, at a CAGR of 13.17% during the forecast period 2025–
Report Studies
• The global 3D Through Glass Via Substrates Market size was valued at US$ 456.80 million in 2024 and is projected to reach US$ 1.23 billion by 2032, at a CAGR of 13.17% during the forecast period 2025–2032.
• 3D Through Glass Via Substrates are advanced packaging solutions that enable vertical electrical connections through glass interposers. These substrates provide superior signal integrity, thermal stability, and miniaturization capabilities compared to traditional silicon-based interposers. Key applications include highperformance computing, 5G RF modules, MEMS packaging, and advanced CMOS image sensors.
• The market is segmented based on type into: • 300 mm Wafer • 200 mm Wafer • Below 150 mm Wafer
• The market is segmented based on application into:
• Consumer Electronics
• Automotive Industry
• Others
• Corning Incorporated (U.S.)
• LPKF Laser & Electronics AG (Germany)
• Samtec (U.S.)
• KISO WAVE Co., Ltd. (Japan)
• Tecnisco (Japan)
• Microplex (Switzerland)
