mm Wafer Chemical Mechanical Polishing Machines Market was valued at 452 million in 2024 and is projected to reach US$ 619 million by 2032, at a CAGR of 4.7% during the forecast period
Report Studies
• The global 200 mm Wafer Chemical Mechanical Polishing Machines Market was valued at 452 million in 2024 and is projected to reach US$ 619 million by 2032, at a CAGR of 4.7% during the forecast period.
• Chemical Mechanical Polishing (CMP) machines are critical semiconductor manufacturing tools that combine chemical and mechanical processes to planarize wafer surfaces. These systems use specialized slurries containing abrasives and reactive chemicals to remove material uniformly, enabling precise fabrication of integrated circuits. The technology is essential for achieving the nanometer-level flatness required in advanced chip production across multiple layers including copper interconnects, silicon dioxide, and tungsten plugs.
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By Type:
• The market is segmented based on type into:
• Copper CMP Machines
• Subtypes: Single-side and double-side polishing systems
• Silicon Oxide CMP Machines
• Front-end Tungsten CMP Machines
• Interlayer Dielectric Layer CMP Machines
• Wafer Silicon Surface CMP Machines
• Polysilicon CMP Machines
• Others
By Application:
• The market is segmented based on application into:
• IDM (Integrated Device Manufacturers)
• Foundry
• Applied Materials, Inc. (U.S.)
• Ebara Corporation (Japan)
• Tianjin Huahaiqingke Co., Ltd. (China)
• Logitech Limited (U.K.)
• Revasum, Inc. (U.S.)
• Alpsitec S.r.l. (Italy)
