BGA Probing Adapters
36
1. Determine the package code for the BGA package from the BGA package code table from Appendix A on the web site or CD. 2. Determine which components are needed for your testing environment (see examples below). Components can be purchased separately and in any combination of quantities. 3. Locate the package code in the following BGA components table and choose the parts from that row.
Modular BGA Probing Systems The majority of our BGA probing systems are modular; consisting of a probe board with interconnection from each ball to a header pin, an SMT foot soldered to the target board, and a socket assembly. These pieces are plugged together and analysis probes are connected to the headers.
Note: BGA package codes without a number at the end are not thickness dependent. SK-BGA PB-BGA SF-BGA
BGA ZIF SOCKET WITH PROBE BOARD AND SURFACE MOUNT FOOT
LS-BGA PB-BGA SF-BGA
LAND SOCKET WITH PROBE BOARD AND SURFACE MOUNT FOOT
SK-BGA SF-BGA
Ironwood leads the industry in BGA probing systems. We have developed probing adapters for 0.75mm pitch Chipscale BGA packages. Some of the BGA probing adapters incorporate the high-performance GHz BGA sockets.
BGA ZIF SOCKET WITH SURFACE MOUNT FOOT
LS-BGA SF-BGA
LAND SOCKET WITH SURFACE MOUNT FOOT
PB-BGA SF-BGA
PROBE BOARD WITH SURFACE MOUNT FOOT
Tel: 1-800-404-0204 (US Customers) or 1-952-229-8200 • Fax: 1-952-229-8201 • www.ironwoodelectronics.com
P R O B I N G
Selecting BGA Probing Adapter Components: